AD8218
Info: : PRODUCTION
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AD8218

Zero Drift, Bi-Directional Current Shunt Monitor

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 4
1ku List Price Starting From $1.24
Features
  • High common-mode voltage range
    -- 4 V to 80 V operating
    -- -0.3 V to 85 V survival
  • Buffered output voltage
  • Gain = 20 V/V
  • Wide operating temperature range:
    −40°C to +125°C
  • Excellent ac and dc performance
    -- ±100 nV/°C typical offset drift
    -- ±50 μV typical offset
    -- ±5 ppm/°C typical gain drift
    -- 110 dB typical CMRR at dc
Additional Details
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The AD8218 is a high voltage, high resolution current shunt amplifier. It features a set gain of 20 V/V, with a maximum ±0.35% gain error over the entire temperature range. The buffered output voltage directly interfaces with any typical converter. The AD8218 offers excellent input common-mode rejection from 4 V to 80 V. The AD8218 performs bidirectional current measurements across a shunt resistor in a variety of industrial and telecom applications, including motor control, battery management, and base station power amplifier bias control.

The AD8218 offers breakthrough performance throughout the −40°C to +125°C temperature range. It features a zero-drift core, which leads to a typical offset drift of ±100 nV/°C throughout the operating temperature range and the common-mode voltage range. Special attention is devoted to output linearity being maintained throughout the input differential voltage range of 0 mV to ~250 mV. The AD8218 also includes an internal 80 mV reference that can be enabled for optimal dynamic range in unidirectional current sense applications. The typical input offset voltage is ±50 μV.

The AD8218 is offered in an 8-lead MSOP package.

Applications
    High-side current sensing
  • 48V telecom
  • Power Management
  • Base Stations
  • Bidirectional motor control
  • Precision high voltage current sources
Part Models 4
1ku List Price Starting From $1.24

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
AD8218BCPZ-RL
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AD8218BCPZ-WP
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AD8218BRMZ
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AD8218BRMZ-R7
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Product Lifecycle

PCN

Aug 8, 2022

- 22_0192

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Aug 1, 2016

- 16_0035

Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin

Apr 28, 2014

- 13_0224

Assembly Transfer of Select 2x3 and 3x3mm LFCSP Products to STATS ChipPAC China.

Oct 26, 2015

- 15_0176

Assembly Transfer of Select 8/10L MSOP Products to Amkor Philippines

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Aug 8, 2022

- 22_0192

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Aug 1, 2016

- 16_0035

arrow down

Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin

Apr 28, 2014

- 13_0224

arrow down

Assembly Transfer of Select 2x3 and 3x3mm LFCSP Products to STATS ChipPAC China.

Oct 26, 2015

- 15_0176

arrow down

Assembly Transfer of Select 8/10L MSOP Products to Amkor Philippines

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