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- Zero-Chip Interface to Digital Signal Processors
- Complete DACPORT®
On-Chip Voltage Reference
Voltage and Current Outputs - Serial, Twos-Complement Input
- ±3 V Output
- Sample Rates to 390 kSPS
- 94 dB Minimum Signal-to-Noise Ratio
- -81 dB Maximum Total Harmonic Distortion
- 15-Bit Monotonicity
- ±5 V to ±12 V Operation
- 16-Pin Plastic and Ceramic Packages
- Available in Commercial, Industrial and Military Temperature Ranges
The AD766 16-bit DSP DACPORT provides a direct, three-wire interface to the serial ports of popular DSP processors, including the ADSP-2101, TMS320CXX, and DSP56001. No additional "glue logic" is required. The AD766 is also complete, offering on-chip serial-to-parallel input format conversion, a 16-bit current-steering DAC, voltage reference, and a voltage output op amp. The AD766 is fabricated in Analog Devices' BiMOS II mixed-signal process which provides bipolar transistors, MOS transistors, and thin-film resistors for precision analog circuits in addition to CMOS devices for logic.
The design and layout of the AD766 have been optimized for ac performance and are responsible for its guaranteed and tested 94 dB signal-to-noise ratio to 20 kHz and 79 dB SNR to 250 kHz. Laser-trimming the AD766's silicon chromium thin-film resistors reduces total harmonic distortion below −81 dB (at 1 kHz), a specification also production tested. An optional linearity trim pin allows elimination of midscale differential linearity error for even lower THD with small signals.
The AD766's output amplifier provides a ±3 V signal with a high slew rate, small glitch, and fast settling. The output amplifier is short circuit protected and can withstand indefinite shorts to ground.
The serial interface consists of bit clock, data, and latch enable inputs. The twos-complement data word is clocked MSB first on falling clock edges into the serial-to-parallel converter, consistent with the serial protocols of popular DSP processors. The input clock can support data transfers up to 12.5 MHz. The falling edge of latch enable updates the internal DAC input register at the sample rate with the sixteen bits most recently clocked into the serial input register.
The AD766 operates over a ±5 V to ±12 V power supply range. The digital supplies, +VL and −VL, can be separated from the analog signal supplies, +VS and −VS, for reduced digital crosstalk. Separate analog and digital ground pins are also provided. An internal bandgap reference provides a precision voltage source to the output amp that is stable over temperature and time.
Power dissipation is typically 120 mW with ±5 V supplies and 300 mW with ±12 V. The AD766 is available in commercial (0°C to +70°C), industrial (−40°C to +85°C), and military (−55°C to +125°C) grades. Commercial and industrial grade parts are available in a 16-pin plastic DIP; military parts processed to MIL-STD-883B are packaged in a 16-pin ceramic DIP. See Analog Devices' Military Products Databook or current military data sheet for specifications for the military version.
APPLICATIONS
- Digital Signal Processing
- Noise Cancellation
- Radar Jamming
- Automatic Test Equipment
- Precision Industrial Equipment
- Waveform Generation
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Documentation
Solutions Bulletin & Brochure 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
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5962-9201601MEA | 16-Lead Side Brazed CerDIP |
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AD766ANZ | 16-Lead PDIP |
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AD766JNZ | 16-Lead PDIP |
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AD766SD/883B | 16-Lead Side Brazed CerDIP |
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- 5962-9201601MEA
- Pin/Package Drawing
- 16-Lead Side Brazed CerDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD766ANZ
- Pin/Package Drawing
- 16-Lead PDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD766JNZ
- Pin/Package Drawing
- 16-Lead PDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD766SD/883B
- Pin/Package Drawing
- 16-Lead Side Brazed CerDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
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Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
5962-9201601MEA
AD766SD/883B
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
5962-9201601MEA
AD766SD/883B
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
5962-9201601MEA
AD766SD/883B
Feb 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
5962-9201601MEA
AD766SD/883B
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
AD766ANZ
PRODUCTION
AD766JNZ
PRODUCTION
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD766ANZ
PRODUCTION
AD766JNZ
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
Feb 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
AD766ANZ
PRODUCTION
AD766JNZ
PRODUCTION
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD766ANZ
PRODUCTION
AD766JNZ
PRODUCTION