AD7542
Precision 12-Bit CMOS Multiplying IOUT DAC, 4-Bit Bus
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- Resolution: 12 Bits
- Nonlinearity: ±1/2 LSB Tmin to Tmax
- Low Gain Drift: 2ppm/°C typ, 5ppm/°C max
- Microprocessor Compatible
- Full 4-Quadrant Multiplication
- Fast Interface Timing
- Low Power Dissipation: 40 mW max
- Low Cost
- Small Size: 16-pin DIP and 20-Terminal Surface Mount Package
- Latch Free (Protection Schottky Not Required)
The AD7542 is a precision 12-bit CMOS multiplying DAC designed for direct interface to 4- or 8-bit microprocessors.
The functional diagram shows the AD7542 to consist of three 4-bit data registers, a 12-bit DAC register, address decoding logic and a 12-bit CMOS multiplying DAC. Data is loaded into the data registers in three 4-bit bytes, and subsequently transferred to the 12-bit DAC register. All data loading or data transfer operations are identical to the WRITE cycle of a static RAM. A clear input allows the DAC register to be easily reset to all zeros when powering up the device.
Ask a Question
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Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
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AD7542
Documentation
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
- AD7542AQ
- Pin/Package Drawing
- 24-Lead CerDIP (Narrow 0.3 Inch)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD7542BQ
- Pin/Package Drawing
- 24-Lead CerDIP (Narrow 0.3 Inch)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD7542GBQ
- Pin/Package Drawing
- 24-Lead CerDIP (Narrow 0.3 Inch)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD7542GKNZ
- Pin/Package Drawing
- 16-Lead PDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD7542GTQ/883B
- Pin/Package Drawing
- 16-Lead CerDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD7542JNZ
- Pin/Package Drawing
- 16-Lead PDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD7542JPZ
- Pin/Package Drawing
- 20-Lead Flatpack
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD7542KNZ
- Pin/Package Drawing
- 16-Lead PDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD7542KPZ
- Pin/Package Drawing
- 20-Lead Flatpack
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD7542KPZ-REEL
- Pin/Package Drawing
- 20-Lead Flatpack
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD7542KRZ
- Pin/Package Drawing
- 16-Lead SOIC Wide
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD7542TQ/883B
- Pin/Package Drawing
- 16-Lead CerDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
AD7542AQ
AD7542BQ
AD7542GBQ
AD7542GTQ/883B
AD7542TQ/883B
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
AD7542AQ
AD7542BQ
AD7542GBQ
AD7542GTQ/883B
AD7542TQ/883B
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
AD7542AQ
AD7542BQ
AD7542GBQ
AD7542GTQ/883B
AD7542TQ/883B
Feb 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
AD7542AQ
AD7542BQ
AD7542GBQ
AD7542GKNZ
PRODUCTION
AD7542JNZ
PRODUCTION
AD7542JPZ
PRODUCTION
AD7542KNZ
PRODUCTION
AD7542KPZ
PRODUCTION
AD7542KRZ
PRODUCTION
AD7542TQ/883B
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD7542GKNZ
PRODUCTION
AD7542JNZ
PRODUCTION
AD7542KNZ
PRODUCTION
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
AD7542GTQ/883B
AD7542TQ/883B
Feb 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
AD7542GTQ/883B
AD7542TQ/883B
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
AD7542JNZ
PRODUCTION
AD7542KNZ
PRODUCTION
Aug 4, 2010
- 10_0117
Halogen Free Material Change for SOIC_W Products at Carsem
AD7542KRZ
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
AD7542AQ
AD7542BQ
AD7542GBQ
AD7542GTQ/883B
AD7542TQ/883B
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
Feb 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
AD7542AQ
AD7542BQ
AD7542GBQ
AD7542GKNZ
PRODUCTION
AD7542JNZ
PRODUCTION
AD7542JPZ
PRODUCTION
AD7542KNZ
PRODUCTION
AD7542KPZ
PRODUCTION
AD7542KRZ
PRODUCTION
AD7542TQ/883B
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD7542GKNZ
PRODUCTION
AD7542JNZ
PRODUCTION
AD7542KNZ
PRODUCTION
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Feb 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
AD7542JNZ
PRODUCTION
AD7542KNZ
PRODUCTION
Aug 4, 2010
- 10_0117
Halogen Free Material Change for SOIC_W Products at Carsem