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Features
- Microprocessor compatible (6800, 8085, Z80, etc.)
- TTL/CMOS compatible inputs
- On-chip data latches
- Endpoint linearity
- Low power consumption
- Monotonicity guaranteed (full temperature range)
- Latch free (no protection Schottky required)
- Download AD7524-EP Data Sheet (pdf)
- Military temperature range (−55°C to +125°C)
- Controlled manufacturing baseline
- One assembly/test site
- One fabrication site
- Enhanced product change notification
- Qualification data available on request
- V62/12659-01XB DSCC Drawing Number
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APPLICATIONS
- Microprocessor Controlled Gain Circuits
- Microprocessor Controlled Attenuator Circuits
- Microprocessor Controlled Function Generation
- Precision AGC Circuits
- Bus Structured Instruments
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Search
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Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
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AD7524
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
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PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
5962-87700012A
PRODUCTION
5962-8770002EA
5962-87700032A
5962-8770003EA
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
5962-87700012A
PRODUCTION
5962-8770002EA
5962-87700032A
5962-8770003EA
AD7524AQ
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Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
5962-87700012A
PRODUCTION
5962-8770002EA
5962-87700032A
5962-8770003EA
AD7524AQ
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Feb 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
5962-87700012A
PRODUCTION
5962-8770002EA
5962-8770003EA
AD7524AQ
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Feb 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
5962-87700012A
PRODUCTION
5962-8770002EA
5962-87700032A
5962-8770003EA
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-8770002EA
5962-8770003EA
AD7524AQ
AD7524SQ
AD7524TQ
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
AD7524JNZ
PRODUCTION
AD7524KNZ
PRODUCTION
AD7524LNZ
PRODUCTION
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD7524JNZ
PRODUCTION
AD7524KNZ
PRODUCTION
AD7524LNZ
PRODUCTION
Mar 25, 2021
- 21_0080
Amkor Philippines as an Alternate Site for SOICN
AD7524JRZ
PRODUCTION
AD7524JRZ-REEL
PRODUCTION
AD7524JRZ-REEL7
PRODUCTION
Oct 5, 2010
- 10_0146
Halogen Free Material Change for 14/16L SOIC_N Products
AD7524JRZ
PRODUCTION
AD7524JRZ-REEL
PRODUCTION
AD7524JRZ-REEL7
PRODUCTION
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Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
5962-87700012A
PRODUCTION
5962-8770002EA
5962-87700032A
5962-8770003EA
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
5962-87700012A
PRODUCTION
5962-8770002EA
5962-87700032A
5962-8770003EA
AD7524AQ
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Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
5962-87700012A
PRODUCTION
5962-8770002EA
5962-87700032A
5962-8770003EA
AD7524AQ
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Feb 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
5962-87700012A
PRODUCTION
5962-8770002EA
5962-8770003EA
AD7524AQ
AD7524JNZ
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AD7524KPZ-REEL
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AD7524LNZ
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AD7524SQ
AD7524TQ
Feb 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
5962-87700012A
PRODUCTION
5962-8770002EA
5962-87700032A
5962-8770003EA
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-8770002EA
5962-8770003EA
AD7524AQ
AD7524SQ
AD7524TQ
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
AD7524JNZ
PRODUCTION
AD7524KNZ
PRODUCTION
AD7524LNZ
PRODUCTION
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD7524JNZ
PRODUCTION
AD7524KNZ
PRODUCTION
AD7524LNZ
PRODUCTION
Mar 25, 2021
- 21_0080
Amkor Philippines as an Alternate Site for SOICN
AD7524JRZ
PRODUCTION
AD7524JRZ-REEL
PRODUCTION
AD7524JRZ-REEL7
PRODUCTION
Oct 5, 2010
- 10_0146
Halogen Free Material Change for 14/16L SOIC_N Products
AD7524JRZ
PRODUCTION
AD7524JRZ-REEL
PRODUCTION
AD7524JRZ-REEL7
PRODUCTION
Tools & Simulations 1
Precision DAC Error Budget Tool
