AD600
Dual, Low Noise, Wideband Variable Gain Amplifier, 0 dB To +40 dB Gain
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Features
- 2 channels with independent gain control
Linear in dB gain response - 2 gain ranges
AD600: 0 dB to 40 dB
AD602: -10 dB to +30 dB - Accurate absolute gain: ±0.3 dB
- Low input noise: 1.4 nV/√Hz
- Low distortion: -60 dBc THD at ±1 V output
- High bandwidth: dc to 35 MHz (-3 dB)
- Stable group delay: ±2 ns
- Low power: 125 mW (maximum) per amplifier
- Signal gating function for each amplifier
- Drives high speed ADCs
- MIL-STD-883-compliant and DESC versions available
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The AD600/AD602 dual channel, low noise, variable gain amplifiers are optimized for use in ultrasound imaging systems, but are applicable to any application requiring precise gain, low noise and distortion, and wide bandwidth. Each independent channel provides a gain of 0 dB to +40 dB in the AD600 and -10 dB to +30 dB in the AD602. The lower gain of the AD602 results in an improved signal-to-noise ratio (SNR) at the output. However, both products have the same 1.4 nV/√Hz input noise spectral density. The decibel gain is directly proportional to the control voltage, accurately calibrated, and supply and temperature-stable.
To achieve the difficult performance objectives, a proprietary circuit form, the X-AMP®, was developed. Each channel of the X-AMP comprises a variable attenuator of 0 dB to -42.14 dB followed by a high speed fixed gain amplifier. In this way, the amplifier never has to cope with large inputs, and can benefit from the use of negative feedback to precisely define the gain and dynamics. The attenuator is realized as a 7-stage R-2R ladder network having an input resistance of 100 W, laser trimmed to ±2%. The attenuation between tap points is 6.02 dB; the gain-control circuit provides continuous interpolation between these taps. The resulting control function is linear in dB.
The gain-control interfaces are fully differential, providing an input resistance of ~15 M W and a scale factor of 32 dB/V (that is, 31.25 mV/dB) defined by an internal voltage reference. The response time of this interface is less than 1 µs. Each channel also has an independent gating facility that optionally blocks signal transmission and sets the dc output level to within a few millivolts of the output ground. The gating control input is TTL- and CMOS-compatible.
The maximum gain of the AD600 is 41.07 dB, and the maximum gain of the AD602 is 31.07 dB; the -3 dB bandwidth of both models is nominally 35 MHz, essentially independent of the gain. The SNR for a 1 V rms output and a 1 MHz noise bandwidth is typically 76 dB for the AD600 and 86 dB for the AD602. The amplitude response is flat within ±0.5 dB from 100 kHz to 10 MHz; over this frequency range, the group delay varies by less than ±2 ns at all gain settings.
Each amplifier channel can drive 100 W load impedances with low distortion. For example, the peak specified output is ±2.5 V minimum into a 500 W load, or ±1 V into a 100 W load. For a 200 W load in shunt with 5 pF, the total harmonic distortion for a ±1 V sinusoidal output at 10 MHz is typically -60 dBc.
The AD600J/AD602J are specified for operation from 0°C to 70°C and are available in 16-lead PDIP (N) and 16-lead SOIC packages. The AD600A/AD602A are specified for operation from -40°C to +85°C and are available in 16-lead CERDIP (Q) and 16-lead SOIC packages. The AD600S/AD602S are specified for operation from -55°C to +125°C, are available in a 16-lead CERDIP (Q) package, and are MIL-STD-883 compliant. The AD600S/AD602S are also available under DESC SMD 5962-94572.
AD600 - Gain Range: 0 dB to 40 dB
AD602 - Gain Range: -10 dB to + 30 dB
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AD600
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962-9457201MEA |
16-Lead CerDIP
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| AD600ARZ |
16-Lead SOIC Wide
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| AD600ARZ-R7 |
16-Lead SOIC Wide
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| AD600ARZ-RL |
16-Lead SOIC Wide
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| AD600JNZ |
16-Lead PDIP
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| AD600JRZ |
16-Lead SOIC Wide
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| AD600JRZ-R7 |
16-Lead SOIC Wide
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| AD600JRZ-RL |
16-Lead SOIC Wide
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| AD600SQ/883B |
16-Lead CerDIP
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- 5962-9457201MEA
- Pin/Package Drawing
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16-Lead CerDIP
- Documentation
-
HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- AD600ARZ
- Pin/Package Drawing
-
16-Lead SOIC Wide
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD600ARZ-R7
- Pin/Package Drawing
-
16-Lead SOIC Wide
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD600ARZ-RL
- Pin/Package Drawing
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16-Lead SOIC Wide
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- AD600JNZ
- Pin/Package Drawing
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16-Lead PDIP
- Documentation
-
HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- AD600JRZ
- Pin/Package Drawing
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16-Lead SOIC Wide
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- AD600JRZ-R7
- Pin/Package Drawing
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16-Lead SOIC Wide
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD600JRZ-RL
- Pin/Package Drawing
-
16-Lead SOIC Wide
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD600SQ/883B
- Pin/Package Drawing
-
16-Lead CerDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
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Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
5962-9457201MEA
AD600SQ/883B
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-9457201MEA
AD600SQ/883B
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
5962-9457201MEA
AD600SQ/883B
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
5962-9457201MEA
AD600SQ/883B
Feb 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
5962-9457201MEA
AD600SQ/883B
Aug 4, 2010
- 10_0117
Halogen Free Material Change for SOIC_W Products at Carsem
AD600ARZ
AD600ARZ-R7
AD600ARZ-RL
AD600JRZ
AD600JRZ-R7
AD600JRZ-RL
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD600JNZ
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-9457201MEA
AD600SQ/883B
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
Feb 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
Aug 4, 2010
- 10_0117
Halogen Free Material Change for SOIC_W Products at Carsem
AD600ARZ
AD600ARZ-R7
AD600ARZ-RL
AD600JRZ
AD600JRZ-R7
AD600JRZ-RL
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD600JNZ
PRODUCTION
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Tools & Simulations 2
SPICE Model 2
SPICE Model
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