AD5532HS
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AD5532HS

32-Channel 14-Bit bipolar DAC with High Speed 3-Wire Serial Interface

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 1
1ku List Price Starting From $82.93
Features
  • High Integration: 32-Channel DAC in 12 x 12 mm2 CSPBGA
  • Guaranteed Monotonic
  • DSP-/Microcontroller-Compatible Serial Interface
  • Channel Update Rate 1.1 MHz
  • Output Impedance 0.5Ω
  • Selectable Output Voltage
  • 0 V to 5 V or -2.5 V to +2.5V
  • Asynchronous RESET Facility
  • Temperature Range -40°C to +85°C
Additional Details
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The AD5532HS is a 32-channel bipolar voltage-output 14-bit DAC with a high-speed serial interface and is packaged in a tiny 12x12 mm CSPBGA. The selected DAC register is written to via the 3-wire interface. The serial interface operates at clock rates up to 30 MHz and is compatible with DSP and microcontroller interface standards. The output voltage range is 0 V to 5 V or -2.5 V to +2.5 V and is determined by the offset voltage at the OFFS_IN pin. It is restricted to a range from VSS + 2 V to VDD - 2 V because of the headroom of the output amplifier.

The device is operated with AVCC = 5 V ± 5%, DVCC = 2.7 V to 5.25 V, VSS = –4.75 V to –12 V and VDD = +4.75 V to +12 V and requires a stable 2.5 V reference on REF_IN.

PRODUCT HIGHLIGHTS

  1. 32 14-bit DACs in one package, guaranteed monotonic.
  2. The AD5532HS is available in a 74-ball LFBGA package with a body size of 12 mm by 12 mm.

APPLICATIONS

  • Optical
  • Networks
  • Level Setting
  • Instrumentation
  • Automatic Test Equipment
  • Industrial Control Systems
  • Data Acquisition
  • Low Cost I/O
Part Models 1
1ku List Price Starting From $82.93

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
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Product Lifecycle

PCN

Jan 8, 2018

- 17_0215

Change to Assembly Die Bond Epoxy and Mold Compound Materials for AD5532 CSP_BGA Products

Feb 8, 2010

- 04_0080

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

Apr 7, 2009

- 08_0060

Wafer Fab transfer from 6" C6 Analog Devices, Ireland to 8" C6 TSMC, Taiwan

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Jan 8, 2018

- 17_0215

arrow down

Change to Assembly Die Bond Epoxy and Mold Compound Materials for AD5532 CSP_BGA Products

Feb 8, 2010

- 04_0080

arrow down

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

Apr 7, 2009

- 08_0060

arrow down

Wafer Fab transfer from 6" C6 Analog Devices, Ireland to 8" C6 TSMC, Taiwan

Evaluation Kit

Evaluation Kits 1

EVAL-AD5532HS

AD5532HS Evaluation Board

Tools & Simulations

Tools & Simulations 1

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