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- Guaranteed Monotonic
- High Accuracy (INL = ±1 LSB)
- On-chip 1.25 V/2.5 V, 10 ppm/°C reference
- Temperature range: –40°C to +85°C
- Rail-to-rail output amplifier
- Power-down mode
- Package type: 100-lead LQFP (14 mm × 14 mm)
- User Interfaces
- Parallel
- Serial (SPI®-/QSPI™-/MICROWIRE™-/DSP-compatible, featuring data readback)
- I2C-compatible - Robust 6.5 kV HBM and 2 kV FICDM ESD rating
The AD5383 is a complete, single-supply, 32-channel, 12-bit denseDAC® available in a 100-lead LQFP package. All 32 channels have an on-chip output amplifier with rail-to-rail operation. The AD5383 includes a programmable internal 1.25 V/2.5 V, 10 ppm/°C reference; an on-chip channel monitor function that multiplexes the analog outputs to a common MON_OUT pin for external monitoring; and an output amplifier boost mode that allows optimization of the amplifier slew rate. The AD5383 features:
- Double-buffered parallel interface with a 20 ns WR pulse width.
- SPI-/QSPI-/MICROWIRE-/DSP-compatible serial interface with interface speeds in excess of 30 MHz
- I2C-compatible interface that supports a 400 kHz data transfer rate.
An input register followed by a DAC register provides double buffering, allowing the DAC outputs to be updated independently or simultaneously using the LDAC input.
Each channel has a programmable gain and offset adjust register that allows the user to fully calibrate any DAC channel. With boost off, power consumption is typically 0.25 mA/channel.
APPLICATIONS
- Variable optical attenuators (VOA)
- Level setting (ATE)
- Optical microelectro-mechanical systems (MEMS)
- Control systems
- Instrumentation
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AD5383
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Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
AD5383BSTZ-5 | 100-Lead LQFP (14mm x 14mm) |
|
- AD5383BSTZ-5
- Pin/Package Drawing
- 100-Lead LQFP (14mm x 14mm)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
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- Ultra Librarian
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Part Models
Product Lifecycle
PCN
Oct 18, 2016
- 16_0034
Assembly Relocation of Select LQFP,LQFP_EP,MQFP,TQFP,TQFP_EP Products to Stats ChipPAC China Jiangyin
Apr 11, 2014
- 14_0106
AD5380/AD5381/AD5382/AD5383/AD5384 Data Sheet Timing Corrections and Power Supply Sequencing Information
AD5383BSTZ-5
PRODUCTION
May 11, 2012
- 11_0270
AD5381 and AD5383 Redesign and Fab Process Change
AD5383BSTZ-5
PRODUCTION
May 24, 2010
- 10_0124
AD5382/AD5383 data sheet correction
AD5383BSTZ-5
PRODUCTION
Jan 5, 2009
- 07_0077
Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages
Filter by Model
Part Models
Product Lifecycle
PCN
Oct 18, 2016
- 16_0034
Assembly Relocation of Select LQFP,LQFP_EP,MQFP,TQFP,TQFP_EP Products to Stats ChipPAC China Jiangyin
Apr 11, 2014
- 14_0106
AD5380/AD5381/AD5382/AD5383/AD5384 Data Sheet Timing Corrections and Power Supply Sequencing Information
AD5383BSTZ-5
PRODUCTION
May 11, 2012
- 11_0270
AD5381 and AD5383 Redesign and Fab Process Change
May 24, 2010
- 10_0124
AD5382/AD5383 data sheet correction
AD5383BSTZ-5
PRODUCTION
Jan 5, 2009
- 07_0077
Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages
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