AD5383
Info: : PRODUCTION
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AD5383

32-Channel 12-Bit 3 V/5 V Single-Supply Voltage-Output DAC

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Models 1
1ku List Price Starting From $46.56
Features
  • Guaranteed Monotonic
  • High Accuracy (INL = ±1 LSB)
  • On-chip 1.25 V/2.5 V, 10 ppm/°C reference
  • Temperature range: –40°C to +85°C
  • Rail-to-rail output amplifier
  • Power-down mode
  • Package type: 100-lead LQFP (14 mm × 14 mm)
  • User Interfaces
    - Parallel
    - Serial (SPI®-/QSPI-/MICROWIRE-/DSP-compatible, featuring data readback)
    - I2C-compatible
  • Robust 6.5 kV HBM and 2 kV FICDM ESD rating
Additional Details
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The AD5383 is a complete, single-supply, 32-channel, 12-bit denseDAC® available in a 100-lead LQFP package. All 32 channels have an on-chip output amplifier with rail-to-rail operation. The AD5383 includes a programmable internal 1.25 V/2.5 V, 10 ppm/°C reference; an on-chip channel monitor function that multiplexes the analog outputs to a common MON_OUT pin for external monitoring; and an output amplifier boost mode that allows optimization of the amplifier slew rate. The AD5383 features:

  • Double-buffered parallel interface with a 20 ns WR pulse width.
  • SPI-/QSPI-/MICROWIRE-/DSP-compatible serial interface with interface speeds in excess of 30 MHz
  • I2C-compatible interface that supports a 400 kHz data transfer rate.

An input register followed by a DAC register provides double buffering, allowing the DAC outputs to be updated independently or simultaneously using the LDAC input.

Each channel has a programmable gain and offset adjust register that allows the user to fully calibrate any DAC channel. With boost off, power consumption is typically 0.25 mA/channel.

APPLICATIONS

  • Variable optical attenuators (VOA)
  • Level setting (ATE)
  • Optical microelectro-mechanical systems (MEMS)
  • Control systems
  • Instrumentation
Part Models 1
1ku List Price Starting From $46.56

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
AD5383BSTZ-5
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Product Lifecycle

PCN

Oct 18, 2016

- 16_0034

Assembly Relocation of Select LQFP,LQFP_EP,MQFP,TQFP,TQFP_EP Products to Stats ChipPAC China Jiangyin

Apr 11, 2014

- 14_0106

AD5380/AD5381/AD5382/AD5383/AD5384 Data Sheet Timing Corrections and Power Supply Sequencing Information

May 11, 2012

- 11_0270

AD5381 and AD5383 Redesign and Fab Process Change

May 24, 2010

- 10_0124

AD5382/AD5383 data sheet correction

Jan 5, 2009

- 07_0077

Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Oct 18, 2016

- 16_0034

arrow down

Assembly Relocation of Select LQFP,LQFP_EP,MQFP,TQFP,TQFP_EP Products to Stats ChipPAC China Jiangyin

Apr 11, 2014

- 14_0106

arrow down

AD5380/AD5381/AD5382/AD5383/AD5384 Data Sheet Timing Corrections and Power Supply Sequencing Information

May 11, 2012

- 11_0270

arrow down

AD5381 and AD5383 Redesign and Fab Process Change

May 24, 2010

- 10_0124

arrow down
Jan 5, 2009

- 07_0077

arrow down

Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages

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