MAX77801
RECOMMENDED FOR NEW DESIGNS5.5V Input, 2A, High-Efficiency Buck-Boost Converter
2A High-Efficiency Buck and Boost Operating Including Seamless Transition Between Buck and Boost Mode
- Part Models
- 4
- 1ku List Price
- Starting From $0.86
Overview
- VIN Range: 2.30V to 5.5V
- VOUT Range: 2.60V to 4.18V (I2C Programmable in 12.5mV Steps)
- Up to 2A Output Current in Boost Mode (VIN= 3.0V, VOUT = 3.4V)
- Up to 3A Output Current in Buck Mode
- Up to 97% Peak Efficiency
- SKIP Mode for Optimal Light Load Efficiency
- 55µA (typ) Low Quiescent Current
- 3.4MHz High-Speed I2C Serial Interface
- Dynamic Voltage Scaling (DVS) Function
- Power-OK Output
- 2.5MHz Switching Frequency
- Protection Features
- Soft-Start
- Thermal Shutdown
- Overvoltage Protection
- Overcurrent Protection
- 2.13mm x 1.83mm, 20-Bump WLP
- 4mm x 4mm, 20-Pin TQFN
The MAX77801 is a high-efficiency, step-up/step-down (buck-boost) converter targeted for single-cell, Li-ion battery-powered applications. The device maintains a regulated output voltage from 2.6V to 4.18V across an input voltage range of 2.3V to 5.5V. The device supports up to 2A of output current in boost mode and up to 3A in buck mode.
The device seamlessly transitions between buck and boost modes. A unique control algorithm allows high-efficiency and outstanding load and line-transient response.
Dedicated enable and power-OK pins allow simple hardware control. An I2C serial interface is optionally used for dynamic voltage scaling, system power optimization, and fault read-back.
The MAX77801 is available in a 20-bump, 2.13mm x 1.83mm wafer-level package (WLP) and also 20-pin, 4mm x 4mm TQFN.
Applications
- AR/VR Headsets
- Handheld Scanners, Mobile Payment Terminals, Security Cameras
- Single-Cell, Li-Ion Battery-Powered Devices
Documentation
Data Sheet 1
Design Note 1
Technical Articles 2
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX77801ETP+ | Thin Quad Flatpack, No Leads | ||
| MAX77801ETP+T | Thin Quad Flatpack, No Leads | ||
| MAX77801EWP+ | Wafer-Level Package 5x4 Bump, Full Array | ||
| MAX77801EWP+T | Wafer-Level Package 5x4 Bump, Full Array |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Apr 20, 2026 - 2571D PIN/ERRATA |
||
| MAX77801ETP+T | PRODUCTION | |
|
Dec 16, 2015 - 1604 TEST |
||
| MAX77801EWP+ | PRODUCTION | |
| MAX77801EWP+T | PRODUCTION | |
|
Dec 21, 2016 - 1671A ASSEMBLY |
||
| MAX77801EWP+T | PRODUCTION | |
|
Jul 19, 2016 - 1594_AMENDED ASSEMBLY |
||
| MAX77801EWP+T | PRODUCTION | |
|
Dec 8, 2015 - 1594_PRE-PCN WAFER FAB |
||
| MAX77801EWP+T | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Software Resources
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Evaluation Kits
Evaluation Kit for MAX77801
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