LTM3360B
RECOMMENDED FOR NEW DESIGNS5VIN, 33A High-Density Step-Down DC-to-DC μModule Regulator with I2C and Integrated Capacitors
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Overview
- Highest Output Current to Total Solution Footprint (1A/mm2), Integrates all CINs, COUTs, and Inductors
- Fast Transient Response
- VIN Range: 2.9V to 5.5V
- VOUT Range: 0.3V to 1V
- Remote Differential Output Sense Pins
- VOUT + DC accuracy: ±1%
- I2C Serial Interface—Telemetry Readback Includesm VOUT, IOUT, VIN, and Die Temperature
- Analog IMON pin for Output Current Monitoring
- Fixed Clock Frequency of 5MHz, External SYNC from 4.5MHz to 5.5MHz
- Parallel Operation: Multiphase up to 12 phases and Stackable to > 1000A
- Advanced Thermally Enhanced 160-Lead, 6.55mm × 5mm × 3.31mm, BGA Package
The LTM®3360B is a high-current, high-density, lowvoltage buck power μModule® (micromodule) regulator optimized for high-output current applications. The 2.9V to 5.5V input voltage range accommodates an intermediate bus voltage (IBV) of 5V ±10% or 3.3V ±10%. The current output capability of 33A can be paralleled to provide >1000A in a multiphase, stacked from a main-tosubordinate device configuration. Regulated output voltages down to 0.3V are achieved using a current mode architecture, which is capable of small on-time at very high frequencies. Select an appropriate feedback resistor divider to configure the output voltage. The 0.3V (default) feedback voltage is 8-bit adjustable through an I2C for margining or dynamic voltage scaling. Keep the feedback voltage close to 0.3V for the best phase-margin voltage regulation loop. The high fixed clock frequency of 5MHz which is double the switching frequency of 2.5MHz each phase permits integration of input and output capacitors and a power inductor, resulting in the highest density of output current-to-board footprint achievable in the industry today with minimal external components required. The LTM3360B is offered in a ball grid array (BGA) package, 0.4mm ball pitch, with excellent thermal performance and integrated inductors, input, and output capacitors. The LTM3360B is lead(Pb)-free and RoHS-compliant.
APPLICATIONS
- Data Centers xPU Core, Application-Specific Integrated Circuit (ASIC), Field-Programmable Gate Array (FPGA) Supplies
- Optical Modules
- Industrial and Communications
- Distributed DC Point-of-Load (POL) Power Systems
Documentation
Video 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| LTM3360BIY#PBF | CSP_BGA |
Software Resources
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LTspice 1
Models for the following parts are available in LTspice:
- LTM3360B
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.
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