HMC773

Obsolete

HMC773 / HMC773LC3B

GaAsmonolithic microwave integrated circuit (MMIC) fundamental mixer chip and surface mount technology (SMT) 6 GHz to 26 GHz.

Data Sheet Product Selection Table

Part Models: 5
1ku List Price: price unavailable

Viewing:

Overview

Passive: no dc bias required
High input IP3: +22 dBm
High local oscillator (LO) radio frequency (RF) isolation: 38 dB
Wide intermediate frequency (IF) bandwidth: dc to 8 GHz
Upconversion and downconversion applications (HMC773)
Die size (HMC773): 1.37 mm × 0.96 mm × 0.1 mm
12-Lead 3 mm × 3 mm SMT package: 9 mm² (HMC773LC3B)

The HMC773 devices are general purpose double-balanced mixers available in a chip (HMC773) and a leadless RoHS compliant SMT package (HMC773LC3B), both of which can be used as an upconverter or downconverter between 6 GHz and 26 GHz. These mixers require no external components or matching circuitry. The HMC773 devices provide excellent LO to RF and LO to IF suppression due to optimized balun structures. The mixers operate with LO drive levels greater than 13 dBm. The HMC773 wideband mixer exhibits consistent conversion gain and compression across its bandwidth. The HMC773LC3B eliminates the need for wire bonding, allowing use of surface mount manufacturing techniques.

Applications

Point-to-point radios
Point-to-multipoint radios
Very small aperture terminal (VSAT)
Test equipment and sensors
Military end use

Suggested Replacement Parts

Part Models: 5
1ku List Price: price unavailable

Documentation

Data Sheet 2

HMC773 Die Data Sheet 04/15/2015

HMC773LC3B Data Sheet 04/15/2015

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC773	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC773-SX	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC773LC3B	12-Lead LCC (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC773LC3BTR	12-Lead LCC (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC773LC3BTR-R5	12-Lead LCC (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jan 11, 2017 - 16_0010 Discontinuance of Select RF and Microwave Products
		PDN16_0010_Form Material_Report
HMC773	Obsolete
HMC773-SX	Obsolete
HMC773LC3B
HMC773LC3BTR
HMC773LC3BTR-R5	Obsolete