Features and Benefits
- 512 (horizontal) × 640 (vertical) pixel array
- 3.5 μm × 3.5 μm square pixels
- 1/6 inch optical format
- 4-wire SPI or 2-wire I2C serial interface
- MIPI CSI-2 transmitter interface with support for 1 or 2 data lanes, programmable up to 2.5 Gbps per lane
- Dual, 3.3 V and 1.2 V external supplies, 1.8 V input and output section
- Die size: 3.749 mm± 0.01 mm × 6.4544 mm ± 0.01 mm
The ADSD3030 is a CMOS 3D Time of Flight (ToF)-based 3D depth and 2D visual light imager that is available for integration into 3D sensor systems. The functional blocks required for read out, which include analog-to-digital converters (ADCs), amplifiers, pixel biasing circuitry, and sensor control logic, are built into the chip to enable a cost-effective and simple implementation into systems.
The ADSD3030 interfaces electrically to a host system over a mobile industry processor interface (MIPI), Camera Serial Interface 2 (CSI-2) interface. A lens plus optical band-pass filter for the imager and an infrared light source plus an associated driver are required to complete the working subsystem.
- Augmented reality (AR) and virtual reality (VR)
- Machine vision systems (logistics and inventory)
- Robotics (consumer and industrial)
Markets and Technologies
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.
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