AD7847

PRODUCTION

LC²MOS Complete, Dual 12-Bit MDAC, Parallel Loading Structure

Data Sheet (Rev. C) Product Selection Table

Part Models: 8
1ku List Price: Starting From $25.00

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Overview

Two 12-Bit MDACs with Output Amplifiers
Space-Saving 0.3", 24-Lead DIP an 24-Terminal SOIC Package

4-Quadrant Multiplication
Parallel Loading Structure: AD7847
(8+4) Loading Structure: AD7837

The AD7837 / AD7847 is a complete, dual, 12-bit multiplying digital-to-analog converter with output amplifiers on a monolithic CMOS chip. No external user trims are required to achieve full specified performance.

Both parts are microprocessor compatible, with high speed data latches and interface logic. The AD7847 accepts 12-bit parallel data which is loaded into the respective DAC latch using the WR input and a separate Chip Select input for each DAC. The AD7837 has a double-buffered 8-bit bus interface structure with data loaded to the respective input latch in two write operations. An asynchronous LDAC signal on the AD7837 updates the DAC latches and analog outputs.

The output amplifiers are capable of developing ±10 V across a 2 kΩ load. They are internally compensated with low input offset voltage due to laser trimming at wafer level.

The amplifier feedback resistors are internally connected to V_OUT on the AD7847.

The AD7837 / AD7847 is fabricated in Linear Compatible CMOS (LC²MOS), an advanced, mixed technology process that combines precision bipolar circuits with low power CMOS logic.

A novel low leakage configuration ensures low offset errors over the specified temperature range.

Part Models: 8
1ku List Price: Starting From $25.00

Documentation

Data Sheet 2

AD7837/AD7847: LC²MOS Complete, Dual 12-Bit MDACs Data Sheet (Rev.C) 01/26/1990

AD7847: Military Data Sheet 01/01/2000

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
5962-9451802MLA	24-Lead CerDIP (Narrow 0.3 Inch)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
AD7847ANZ	24-Lead PDIP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
AD7847AQ	24-Lead CerDIP (Narrow 0.3 Inch)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
AD7847ARZ	24-Lead SOIC (Wide)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
AD7847ARZ-REEL	24-Lead SOIC (Wide)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
AD7847BNZ	24-Lead PDIP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
AD7847BRZ	24-Lead SOIC (Wide)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
AD7847BRZ-REEL	24-Lead SOIC (Wide)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
5962-9451802MLA
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
5962-9451802MLA
AD7847AQ
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
5962-9451802MLA
AD7847AQ
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
5962-9451802MLA
AD7847AQ
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
		PCN04_0080_Form Material_Report Reliability Report Reliability Report
5962-9451802MLA
AD7847ANZ	PRODUCTION
AD7847AQ
AD7847ARZ	PRODUCTION
AD7847ARZ-REEL	PRODUCTION
AD7847BNZ	PRODUCTION
AD7847BRZ	PRODUCTION
AD7847BRZ-REEL	PRODUCTION
Feb 1, 2010 - 10_0020 Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
		Material_Report PCN10_0020_Form Qual Plan
5962-9451802MLA		Material_Report PCN10_0020_Form Qual Plan
Mar 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
		PCN19_0046_Form Material_Report Detailed Change Description Qualification Results Summary
AD7847ANZ	PRODUCTION
AD7847BNZ	PRODUCTION
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
AD7847ANZ	PRODUCTION
AD7847BNZ	PRODUCTION
Feb 7, 2011 - 10_0003 Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor
		PCN10_0003_Form Material_Report Qualification Plan Summary
AD7847ARZ	PRODUCTION
AD7847ARZ-REEL	PRODUCTION
AD7847BRZ	PRODUCTION
AD7847BRZ-REEL	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

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Hardware Ecosystem

Parts	Product Life Cycle	Description
AD5752R	PRODUCTION	Complete, Dual, 16-Bit, Serial Input, Unipolar/Bipolar, Voltage Output DAC

Tools & Simulations

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