MAX17271
RECOMMENDED FOR NEW DESIGNSnanoPower Triple-Output, Single-Inductor, Multiple-Output (SIMO) Buck-Boost Regulator
NanoPower SIMO Buck Boost Converter. The Simplest Solution to Replace Clusters of Power Rails
- Part Models
- 4
- 1ku List Price
- Starting From $3.23
Overview
- 3-Output Single-Inductor, Multiple-Output (SIMO) Buck-Boost Regulator
- 2.7V to 5.5V Input Voltage Range
- Low-Power and Long Battery Life
- 1.3µA Operating Current (3 SIMO Channels)
- 330nA Shutdown Current
- 85% Efficiency at 3.3V Output
- Flexible and Configurable
- I2C Compatible Interface (MAX17271)
- Programmable Output Voltage: 0.8V to 5.175V MAX17270/MAX17271
- Programmable Peak Current Limit
- Robust
- Soft-Start
- Overload Protection
- Thermal Protection
- Small Size
- 1.77mm x 1.77mm x 0.50mm, 16-Bump 0.4mm-Pitch WLP Package
- 3mm x 3mm x 0.75mm, 16-pin TQFN Package
- Small Total Solution Size
The MAX17270/MAX17271 are 3-output switching regulators designed for applications requiring efficient regulation of multiple supplies in a very small space, such as wearable electronic devices.
The parts use a buck-boost architecture that regulates three outputs using a single, small 2.2μH inductor at efficiencies up to 85%. This results in smaller board space while delivering better total system efficiency than equivalent power solutions using one buck and linear regulators.
The supply current is 0.85μA when only one output is enabled, plus 0.2μA for each additional output enabled.
This SIMO (Single-Input Multiple-Output) regulator utilizes the entire battery voltage range due to its ability to create output voltages that are above, below, or equal to the input voltage. Peak inductor current for each output is programmable to optimize the balance between efficiency, output ripple, EMI, PCB design, and load capability.
Two versions are available. The MAX17270 has 3 enable inputs and 3 output voltage programming inputs. The MAX17271 includes an I2C interface with interrupt, a push-button turn on/off, and a power-good indication.
All versions are offered in either a 4 x 4, 0.4mm wafer-level package (WLP) or a 16-pin TQFN package.
Design Solution: Choose a Tailored SIMO PMIC for Your Portable Design ›
Applications
- Bluetooth Headsets
- Fitness Bands
- Health Monitors
- Hearables
- Internet of Things (IoT)
- Watches
- Wearables
Documentation
Data Sheet 1
User Guide 1
Technical Articles 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX17271ENE+ | Thin Wafer-Level Package 4x4 Bump, Full Array | ||
| MAX17271ENE+T | Thin Wafer-Level Package 4x4 Bump, Full Array | ||
| MAX17271ETE+ | LFCSP | ||
| MAX17271ETE+T | LFCSP |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Apr 27, 2024 - 2400 ASSEMBLY |
||
| MAX17271ETE+ | PRODUCTION | |
| MAX17271ETE+T | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
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