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提问
在下面提交您的问题，我们将从 ADI 的知识库中给出最佳答案:
搜索
您可以在其他地方找到帮助
特性
- 两个12位MDAC，内置输出放大器
- 0.3"、24引脚DIP和24引脚SOIC封装，节省空间
- 四象限乘法
- 并行加载结构AD7847
- (8+4)加载结构：AD7837
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提问
在下面提交您的问题，我们将从 ADI 的知识库中给出最佳答案:
搜索
您可以在其他地方找到帮助
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产品技术资料帮助
ADI公司所提供的资料均视为准确、可靠。但本公司不为用户在应用过程中侵犯任何专利权或第三方权利承担任何责任。技术指标的修改不再另行通知。本公司既没有含蓄的允许，也不允许借用ADI公司的专利或专利权的名义。本文出现的商标和注册商标所有权分别属于相应的公司。
参考资料
ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。
| 产品型号 | 引脚/封装图-中文版 | 文档 | CAD 符号，脚注和 3D模型 |
|---|---|---|---|
| 5962-9451802MLA |
24-Lead CerDIP (Narrow 0.3 Inch)
|
|
|
| AD7847ANZ |
24-Lead PDIP
|
|
|
| AD7847AQ |
24-Lead CerDIP (Narrow 0.3 Inch)
|
|
|
| AD7847ARZ |
24-Lead SOIC (Wide)
|
|
|
| AD7847ARZ-REEL |
24-Lead SOIC (Wide)
|
|
|
| AD7847BNZ |
24-Lead PDIP
|
|
|
| AD7847BRZ |
24-Lead SOIC (Wide)
|
|
|
| AD7847BRZ-REEL |
24-Lead SOIC (Wide)
|
|
- 5962-9451802MLA
- 引脚/封装图-中文版
-
24-Lead CerDIP (Narrow 0.3 Inch)
- 文档
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD 符号，脚注和 3D模型
-
Ultra Librarian
-
SamacSys
- AD7847ANZ
- 引脚/封装图-中文版
-
24-Lead PDIP
- 文档
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD 符号，脚注和 3D模型
-
Ultra Librarian
-
SamacSys
- AD7847AQ
- 引脚/封装图-中文版
-
24-Lead CerDIP (Narrow 0.3 Inch)
- 文档
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD 符号，脚注和 3D模型
-
Ultra Librarian
-
SamacSys
- AD7847ARZ
- 引脚/封装图-中文版
-
24-Lead SOIC (Wide)
- 文档
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD 符号，脚注和 3D模型
-
Ultra Librarian
-
SamacSys
- AD7847ARZ-REEL
- 引脚/封装图-中文版
-
24-Lead SOIC (Wide)
- 文档
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD 符号，脚注和 3D模型
-
Ultra Librarian
-
SamacSys
- AD7847BNZ
- 引脚/封装图-中文版
-
24-Lead PDIP
- 文档
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD 符号，脚注和 3D模型
-
Ultra Librarian
-
SamacSys
- AD7847BRZ
- 引脚/封装图-中文版
-
24-Lead SOIC (Wide)
- 文档
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD 符号，脚注和 3D模型
-
Ultra Librarian
-
SamacSys
- AD7847BRZ-REEL
- 引脚/封装图-中文版
-
24-Lead SOIC (Wide)
- 文档
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD 符号，脚注和 3D模型
-
Ultra Librarian
-
SamacSys
根据型号筛选
产品型号
产品生命周期
PCN
4月 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
5962-9451802MLA
11月 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-9451802MLA
AD7847AQ
11月 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
5962-9451802MLA
AD7847AQ
11月 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
5962-9451802MLA
AD7847AQ
2月 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
5962-9451802MLA
AD7847ANZ
量产
AD7847AQ
AD7847ARZ
量产
AD7847ARZ-REEL
量产
AD7847BNZ
量产
AD7847BRZ
量产
AD7847BRZ-REEL
量产
2月 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
5962-9451802MLA
3月 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
AD7847ANZ
量产
AD7847BNZ
量产
8月 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD7847ANZ
量产
AD7847BNZ
量产
2月 7, 2011
- 10_0003
Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor
AD7847ARZ
量产
AD7847ARZ-REEL
量产
AD7847BRZ
量产
AD7847BRZ-REEL
量产
根据型号筛选
产品型号
产品生命周期
PCN
4月 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
11月 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-9451802MLA
AD7847AQ
11月 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
11月 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
2月 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
5962-9451802MLA
AD7847ANZ
量产
AD7847AQ
AD7847ARZ
量产
AD7847ARZ-REEL
量产
AD7847BNZ
量产
AD7847BRZ
量产
AD7847BRZ-REEL
量产
2月 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
3月 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
AD7847ANZ
量产
AD7847BNZ
量产
8月 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD7847ANZ
量产
AD7847BNZ
量产
2月 7, 2011
- 10_0003
Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor
AD7847ARZ
量产
AD7847ARZ-REEL
量产
AD7847BRZ
量产
AD7847BRZ-REEL
量产
工具及仿真模型 1
精密DAC误差预算工具
