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For RoHS info, MSL, Peak reflow solder temp and pkg weight please refer to the RoHS material declaration page, this is not a full declaration. For a full Material Declaration please click on desired package below.

Brominated flame retardant additives (if present) in the mold compounds used by ADI are incorporated into the epoxy matrix during the curing process and are not present in the free state in the final product.

For further assistance please contact 1-800-ANALOGD.