BGA (Ball Grid Array)

• CBGA (Ceramic)
• FCBGA
• PBGA (Plastic)
• SBGA (w/Heatsink)

CSP (Chip Scale Package)

• CSP BGA (Ball Grid Array)
• LFCSP (LeadFrame)
• LGA (Land Grid Array)
• Tape CSP BGA
• WLCSP (Wafer Level)

DIP (Dual Inline Package)

• CerDIP (Ceramic)
• CerDIP - Side or Bottom Brazed
• DIP Gullwing Leads
• Metal or Hybrid DIP
• PDIP (Plastic)

FlatPack

• Ceramic Flat Package

Header

• Modules
• TO-92 (Plastic Header)
• TO-XX (Metal Header)

LCC (Leaded or Leadless Chip Carrier)

• CLCC - Gullwing Leads
• J leaded CLCC
• LCC (Leadless Ceramic)
• PLCC (Plastic, Leaded)
• PLCC w/heat sink

PGA (Pin Grid Array)

• Ceramic Pin Grid Array

QFP (Quad Flat Pack)

• CQFP (Ceramic)
• LQFP 1.4mm thick
• LQFP w/heat sink
• MQFP
• MQFP - Thermally Enhanced
• TQFP (Thin, 1.0mm)
• TQFP - Thermally Enhanced

SIP (Single Inline Package)

• SIP Horizontal Leads
• SIP Vertical Leads

SOIC (Small Outline IC)

• PCP (SOIC)
• PSOP (SOIC w/heatslug)
• SOIC (Narrow)
• SOIC (Wide)

SOP (Small Outline Package)

• MSOP (micro-SOP)
• QSOP (25mil pitch)
• SSOP (Shrink SO)
• Thermally Enhanced [PSOP/2]
• TSSOP (Thin, 1.2mm)
• TSSOP_EP

SOT (Small Outline Transistor)

• SC-70
• SOT-143
• SOT-223
• SOT-23
• SOT-66
• SOT-89
• TSOT-23 (Thin, 0.9mm)

• AN-000: Thermal Characteristics (pdf, 122,880 bytes)
• AN-001: Tube and Tray Device Counts (pdf, 53,248 bytes)
• AN-002: Tape and Reel Devices (pdf, 937,984 bytes)
• AN-617: MicroCSP Wafer Level Chip Scale Package (pdf, 446,464 bytes)
• AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) (pdf, 450,560 bytes)
• MT-092: Electrostatic Discharge (ESD) (pdf, 159,744 bytes)
• MT-093: Thermal Design Basics (pdf, 258,048 bytes)

• MT-094: Microstrip and Stripline Design (pdf, 102,400 bytes)
• MT-095: EMI, RFI, and Shielding Concepts (pdf, 151,552 bytes)
• MT-096: RFI Rectification Concepts (pdf, 122,880 bytes)
• MT-097: Dealing with High-Speed Logic (pdf, 126,976 bytes)
• MT-098: Low Voltage Logic Interfacing (pdf, 212,992 bytes)
• MT-099: Analog Circuit Simulation (pdf, 2,404,352 bytes)
• MT-100: Breadboarding and Prototyping Techniques (pdf, 1,089,536 bytes)
• MT-101: Decoupling Techniques (pdf, 978,944 bytes)