HMC-XDB112

x2 Passive Frequency Multiplier Chip, 20 - 30 GHz Output

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Overview

Conversion Loss: 13 dB
Passive: No DC Bias Required
Input Drive: +13 dBm

High Fo Isolation: 30 dB
Die Size: 2.2 x 0.65 x 0.1 mm

The HMC-XDB112 is a monolithic Passive Frequency Doubler which utilizes GaAs Heterojunction Bipolar Transistor (HBT) technology, and is targeted to high volume applications where frequency doubling of a lower frequency is more economical than directly generating a higher frequency. All bond pads and the die backside are Ti/Au metallized and the HBT devices are fully passivated for reliable operation.

The HMC-XDB112 Passive Doubler MMIC is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.

APPLICATIONS