AD7741
PRODUCTIONSingle and Multichannel, Synchronous Voltage-to-Frequency Converters
- Part Models
- 4
- 1ku List Price
- Starting From $3.44
Part Details
- AD7741: One Single-Ended Input Channel
- AD7742: Two Differential or Three Pseudo-Differential Input Channels
- Integral Nonlinearity of 0.012% at fOUT(Max) = 2.75 MHz (AD7742) and at fOUT(Max) = 1.35 MHz (AD7741)
- Single +5 V Supply Operation
- Buffered Inputs
- Programmable Gain Analog Front-End
- On-Chip +2.5 V Reference
- Internal/External Reference Option
- Power Down to 35 µA Max
- Minimal External Components Required
- 8-Lead and 16-Lead DIP and SOIC Packages
The AD7741/AD7742 are a new generation of synchronous voltage-to-frequency converters (VFCs). The AD7741 is a single-channel version in an 8-lead package (SOIC/DIP) and the AD7742 is a multichannel version in a 16-lead package (SOIC/DIP). No user trimming is required to achieve the specified performance.
The AD7741 has a single buffered input whereas the AD7742 has four buffered inputs that may be configured as two fully-differential inputs or three pseudo-differential inputs. Both parts include an on-chip +2.5 V bandgap reference that provides the user with the option of using this internal reference or an external reference.
The AD7741 has a single-ended voltage input range from 0 V to REFIN. The AD7742 has a differential voltage input range from –VREF to +VREF. Both parts operate from a single +5 V supply consuming typically 6 mA, and also contain a power down feature that reduces the current consumption to less than 35 μA.
Applications
- Low Cost Analog-to-Digital Conversion
- Signal Isolation
- AD7742 is obsolete
Documentation
Data Sheet 1
Application Note 2
Frequently Asked Question 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
AD7741BNZ | 8 ld PDIP | ||
AD7741BRZ | 8 ld SOIC | ||
AD7741BRZ-REEL7 | 8 ld SOIC | ||
AD7741YRZ | 8 ld SOIC |
Part Models | Product Lifecycle | PCN |
---|---|---|
Feb 17, 2014 - 13_0265 Qualification of ASE Chungli, as an Alternate Assembly Site for Select 8L and 14L SOICN Packages |
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AD7741BNZ | PRODUCTION | |
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland. |
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AD7741BNZ | PRODUCTION | |
AD7741BRZ | PRODUCTION | |
AD7741BRZ-REEL7 | PRODUCTION | |
AD7741YRZ | PRODUCTION | |
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
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AD7741BNZ | PRODUCTION | |
Nov 13, 2013 - 13_0265 Qualification of ASE Chungli, as an Alternate Assembly Site for Select 8L and 14L SOICN Packages |
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AD7741BRZ | PRODUCTION | |
AD7741BRZ-REEL7 | PRODUCTION | |
AD7741YRZ | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.