HMC554
HMC554 / HMC554LC3B
GaAs monolithic microwave integrated circuit (MMIC) double-balanced mixer chip and surface mount technology (SMT), 11 GHz to 20 GHz製品情報
- High local oscillator (LO) radio frequency (RF) isolation: 46 dBm
- Passive double-balanced topology
- Low conversion loss: 7 dB
- Wide intermediate frequency (IF) bandwidth: dc to 6 GHz
- Small size (HMC554): 0.83 mm × 1.12 mm × 0.1 mm
- RoHS compliant 3 mm ×3 mm SMT package (HMC554LC3B)
The HMC554 devices are passive (HMC554) and general purpose (HMC554LC3B) double-balanced mixers that are available in a chip (HMC554) and a leadless RoHS compliant SMT package (HMC554LC3B), both of which can be used as an upconverter or downconverter between 11 GHz and 20 GHz. These mixers are fabricated in a GaAs metal semiconductor field effect transistor (MESFET) process, and require no external components or matching circuitry. The HMC554G devices provide excellent LO to RF and LO to IF isolation due to optimized balun structures. Measurements were made with the HMC554 chip mounted into in a 50 Ω test fixture and includes the parasitic effects of wire bond assembly. Connections were made with a 1 mil wire bond with minimal length (<12 mil). The RoHS compliant HMC554LC3B eliminates the need for wire bonding, and is compatible with high volume surface mount manufacturing techniques.
Applications
- Point-to-point radios
- Point-to-multipoint radios
- Test equipment and sensors
- Military end use
- Microwave radio
- Space
- Communications, radar, and electronic warfare (EW)
ドキュメント
これは最新改訂バージョンのデータシートです。
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HMC554LC3B Evaluation Board