EVAL-ADPA1112

Product Details

The ADPA1112-EVALZ is a 2-layer printed circuit board (PCB) fabricated from 10mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader in providing thermal relief to the ADPA1112 and mechanical support to the PCB. The mounting holes on the heat spreader allow attachment to larger heatsinks to improve thermal management. The RFIN and RFOUT ports are populated by 2.92mm female coaxial connectors, and their respective RF traces are of 50Ω characteristic impedance. The ADPA1112-EVALZ is populated with components suitable for use over the entire operating temperature range of the ADPA1112.

The RF transmission lines are 50Ω grounded coplanar waveguides. The package ground leads connect directly to the ground plane. The package flange is mechanically connected to the heat spreader using four, 0-80 × 3/16" stainless steel, socket head screws. To ensure adequate electrical and thermal conduction from the flange bottom to the heat spreader, an indium shim sits between them.

The power supply decoupling capacitors shown in Figure 5 in the User Guide represent the configuration used to characterize the device. Consult the ADPA1112 data sheet in conjunction with this user guide when working with the ADPA1112-EVALZ evaluation board.