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The judicious combination of bipolar and FET devices in a single monolithic IC results in a product with performance characteristics and ruggedness that are superior to those of a similar circuit fabricated using CMOS technology.
Increased reliability is complemented by excellent electrical specifications. Potential error sources are reduced by minimizing "ON" resistance and controlling leakage currents at high temperatures. The switching FET exhibits minimal RON variation over a 20V analog signal range and with power supply voltage changes. Operation from a single positive power supply voltage is possible. With V+=36V, V-=0V, the analog signal range will extend from ground to +32V.
The PNP logic inputs are TTL and CMOS compatible. Logic input currents are at micro-ampere levels which improves circuit fan in.
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Documentation
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
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SW2010803Q | 16-Lead CerDIP |
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- SW2010803Q
- Pin/Package Drawing
- 16-Lead CerDIP
- Documentation
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- CAD Symbols, Footprints, and 3D Models
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Part Models
Product Lifecycle
PCN
Jul 30, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Nov 18, 2015
- 15_0219
Laser Marking Standardization for Aerospace Packages
Oct 2, 2013
- 13_0163
Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
SW2010803Q
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
SW2010803Q
Feb 9, 2009
- 08_0073
Change of Seal Glass Material for Cerdip & Cerpak Packages
Filter by Model
Part Models
Product Lifecycle
PCN
Jul 30, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Nov 18, 2015
- 15_0219
Laser Marking Standardization for Aerospace Packages
Oct 2, 2013
- 13_0163
Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
Feb 9, 2009
- 08_0073
Change of Seal Glass Material for Cerdip & Cerpak Packages
Software & Part Ecosystem
Tools & Simulations 1
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.
To launch ready-to-run LTspice demonstration circuits for this part:
Step 1: Download and install LTspice on your computer.
Step 2: Click on the link in the section below to download a demonstration circuit.
Step 3: If LTspice does not automatically open after clicking the link below, you can instead run the simulation by right clicking on the link and selecting “Save Target As.” After saving the file to your computer, start LTspice and open the demonstration circuit by selecting ‘Open’ from the ‘File’ menu.