REF193
PRODUCTION3.0V Precision Micropower, Low Dropout, Low Voltage Reference
- Part Models
- 2
- 1ku List Price
- Starting From $2.23
Part Details
- Initial Accuracy: ±2 mV Max
- Temperature Coefficient: 5 ppm/°C Max
- Low Supply Current: 45 µA Max
- Sleep Mode: 15 µA Max
- Low Dropout Voltage
- Load Regulation: 6 ppm/mA
- Line Regulation: 4 ppm/V
- High Output Current: 30 mA
- Short-Circuit Protection
The REF19x series precision band gap voltage references use a patented temperature drift curvature correction circuit and laser trimming of highly stable, thin-film resistors to achieve a very low temperature coefficient and high initial accuracy.
The REF19x series is made up of micropower, low dropout voltage (LDV) devices, providing stable output voltage from supplies as low as 100 mV above the output voltage and consuming less than 45 μA of supply current. In sleep mode, which is enabled by applying a low TTL or CMOS level to the SLEEP pin, the output is turned off and supply current is further reduced to less than 15 μA.
The REF19x series references are specified over the extended industrial temperature range (−40°C to +85°C) with typical performance specifications over −40°C to +125°C for applications, such as automotive.
All electrical grades are available in an 8-lead SOIC package; the PDIP and TSSOP packages are available only in the lowest electrical grade.
APPLICATIONS
- Portable instruments
- ADCs and DACs
- Smart sensors
- Solar powered applications
- Loop-current-powered instruments
Documentation
Data Sheet 1
Frequently Asked Question 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| REF193GSZ | 8-Lead SOIC | ||
| REF193GSZ-REEL | 8-Lead SOIC |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
May 14, 2025 - 25_0087 Qualification of Wafer Fabrication Site at Analog Devices, Inc. Camas for CBCMOS1 Products |
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| REF193GSZ | PRODUCTION | |
| REF193GSZ-REEL | PRODUCTION | |
|
Nov 23, 2010 - 10_0004 Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor |
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| REF193GSZ | PRODUCTION | |
| REF193GSZ-REEL | PRODUCTION | |
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Aug 6, 2010 - 10_0187 REF19x Die Coat Change on SOIC models |
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| REF193GSZ | PRODUCTION | |
| REF193GSZ-REEL | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.