MAX8969
Step-Up Converter for Handheld Applications
1A Boost Converter with Four External Components in a Small, 1.25mm x 1.25mm WLP Package
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Overview
Features and Benefits
- Flexible System Integration
- Up to 1A Output Current
- 2.5V to 5.5V Input Voltage Range
- 3.3V to 5.7V Output Voltage Options
- Integrated Protection Increases System Robustness
- Undervoltage Lockout (UVLO)
- Short-Circuit Protection
- Overtemperature Shutdown
- High Efficiency and Low Quiescent Current Extends Battery Life
- Over 90% Efficiency with Internal Synchronous Rectifier
- 60µA IQ in Automatic Track Mode
- 45µA IQ in Step-Up Mode
- 30µA IQ in Track Mode
- 1µA Shutdown Current
- Skip Mode Under Light Load Condition Improves Efficiency
- True Shutdown™ Prevents Current Flow from OUT_ to LX_
- Soft-Start Limits Inrush Current to 480mA
- Small Package and High Frequency Operation Reduce Board Space
- 9-Bump 1.25mm × 1.25mm WLP Package
- 3MHz PWM Switching Frequency
- Small External Components
Product Details
The MAX8969 is a simple 1A step-up converter in a small package that operates in any single-cell Li-ion application. This IC provides protection features such as input undervoltage lockout, short circuit, and overtemperature shutdown.
The IC transitions to skip mode seamlessly under lightload conditions to improve efficiency. Under these conditions, switching occurs only as needed, reducing switching frequency and supply current to maintain high efficiency.
For higher efficiency when input voltage is closer to the output voltage, two special modes of operation are available: track and automatic track. These modes allow users to balance quiescent current (IQ) vs. transient response time into boost mode. In both modes, the p-channel MOSFET acts as a current-limited switch such that VOUT follows VIN. However, in track mode, the boost circuits are disabled and the system controls the boost function with the EN, TREN inputs (IQ = 30µA). In automatic track mode (ATM), the boost circuits are enabled and the device automatically transitions into boost mode when VIN falls to 95% of the target VOUT (IQ = 60µA).
The IC is available in a small, 1.25mm × 1.25mm, 9-bump WLP (0.4mm pitch) package.
Design Solution: Can You Hear Me Now? Extend the Life of Your Hearable Device ›
Applications
- Cell Phones
- eBooks
- GPS, PND
- Mobile Internet Devices
- Smartphones
Product Categories
Product Lifecycle
Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Evaluation Kits (1)
Documentation & Resources
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MAX8969 Reliability Data1/12/2023PDF29K
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Design Note- ds57-can-you-hear-me-now-extend-the-life-of-your-hearable-device10/10/2022PDF365K
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| MAX8969EWL37+T | Material Declaration | Reliability Data | Wafer-Level Package 3x3 Bump, Full Array | |
| MAX8969EWL42+T | Material Declaration | Reliability Data | Wafer-Level Package 3x3 Bump, Full Array | |
| MAX8969EWL50+ | Material Declaration | Reliability Data | Wafer-Level Package 3x3 Bump, Full Array | |
| MAX8969EWL50+T | Material Declaration | Reliability Data | Wafer-Level Package 3x3 Bump, Full Array | |
| MAX8969EWL53+ | Material Declaration | Reliability Data | Wafer-Level Package 3x3 Bump, Full Array | |
| MAX8969EWL53+T | Material Declaration | Reliability Data | Wafer-Level Package 3x3 Bump, Full Array | |
| MAX8969EWL55+ | Material Declaration | Reliability Data | Wafer-Level Package 3x3 Bump, Full Array | |
| MAX8969EWL55+T | Material Declaration | Reliability Data | Wafer-Level Package 3x3 Bump, Full Array | |
| Wafer Fabrication Data | MAX8969 Reliability Data |
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Evaluation Boards
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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.