MAX3787
NOT RECOMMENDED FOR NEW DESIGNS1Gbps to 12.5Gbps Passive Equalizer for Backplanes and Cables
- Part Models
- 2
- 1ku List Price
- Starting From $1.70
Overview
- No Power Supply Required
- Small 1.5mm x 1.5mm Chip-Scale Package
- Passive Equalization Reduces ISI
- Operates from 1Gbps to 12.5Gbps
- Extends Board Link
- Extends Cable Link
- Coding Independent, 8b/10b or Scrambled
The MAX3787 is a 1Gbps to 12.5Gbps equalization network that compensates for transmission medium losses encountered with FR4 and cables. The equalization network is composed entirely of passive components and functions equally well for 8b/10b or scrambled signals. It is packaged in a small 1.5mm x 1.5mm chipscale package (UCSP™) that can be placed anywhere along the transmission medium to increase jitter margin for high-speed interconnects. Roughly the size of two 0603 components, the MAX3787 easily provides placement and routing flexibility.
At 8.5Gbps, the MAX3787 compensates for spans up to 18in of FR4 and 7m of cable. At 12.5Gbps, the MAX3787 compensates for spans up to 12in of FR4 and 3m of cable. Input and output impedance is 100Ω differential. The MAX3787 requires no power and operates over a -40°C to +125°C temperature range.
Applications
- Backplane Interconnect Compensation
- Cable Interconnect Compensation
- Chassis Life Extension
- Chip-to-Chip Link Extensions
- Ethernet and Fibre Channel Serial Modules
Documentation
Data Sheet 1
Reliability Data 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX3787AWL+ | Wafer-Level Package 3x3 Bump, Depopulated | ||
| MAX3787AWL+T | Wafer-Level Package 3x3 Bump, Depopulated |
This is the most up-to-date revision of the Data Sheet.
Evaluation Kits
Evaluation Kit for the MAX3787
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