MAX3207E
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MAX3207E

Dual, Quad, and Hex High-Speed Differential ESD-Protection ICs

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Part Models 2
1ku List Price Starting From $0.70
Features
  • Low Input Capacitance of 2pF Typical
  • Low Channel-to-Channel Variation of 0.05pF from I/O to I/O
  • High-Speed Differential or Single-Ended ESD Protection
    • ±15kV-Human Body Model
    • ±8kV-IEC 61000-4-2, Contact Discharge
    • ±15kV-IEC 61000-4-2, Air-Gap Discharge
  • Integrated Transient Voltage Suppressor (TVS)
  • Optimized Pinout for Minimized Stub Inductance on Controlled-Impedance Differential-Transmission Line Routing
  • -40°C to +125°C Automotive Operating Temperature Range
  • WLP Packaging Available
Additional Details
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The MAX3205E/MAX3207E/MAX3208E low-capacitance, ±15kV ESD-protection diode arrays with an integrated transient voltage suppressor (TVS) clamp are suitable for high-speed and general-signal ESD protection. Low input capacitance makes these devices ideal for ESD protection of signals in HDTV, PC monitors (DVI™, HDMI®), PC peripherals (FireWire®, USB 2.0), server interconnect (PCI Express®, InfiniBand™), datacom, and interchassis interconnect. Each channel consists of a pair of diodes that steer ESD current pulses to VCC or GND.

The MAX3205E/MAX3207E/MAX3208E protect against ESD pulses up to ±15kV Human Body Model, ±8kV Contact Discharge, and ±15kV Air-Gap Discharge, as specified in IEC 61000-4-2. An integrated TVS ensures that the voltage rise seen on VCC during an ESD event is clamped to a known voltage. These devices have a 2pF input capacitance per channel, and a channel-to-channel capacitance variation of only 0.05pF, making them ideal for use on high-speed, single-ended, or differential signals.

The MAX3207E is a two-channel device suitable for USB 1.1, USB 2.0 (480Mbps), and USB OTG applications. The MAX3208E is a four-channel device for Ethernet and FireWire applications. The MAX3205E is a six-channel device for cell phone connectors and SVGA video connections.

The MAX3205E is available in 9-bump, tiny wafer-level package (WLP) and 16-pin, 3mm x 3mm, thin QFN packages. The MAX3207E is available in a small 6-pin SOT23 package. The MAX3208E is available in 10-pin µMAX® and 16-pin, 3mm x 3mm TQFN packages. All devices are specified for the -40°C to +125°C automotive operating temperature range.

Applications

  • Consumer Equipment
  • Displays/Projectors
  • DVI™ Input/Output Protection
  • FireWire® IEEE 1394™ Ports
  • Graphics Controller Cards
  • High-Speed Differential Signal Protection
  • High-Speed, Full-Speed and Low-Speed USB
  • PDAs and Cell Phones
  • Port Protection
  • Set-Top Boxes
Part Models 2
1ku List Price Starting From $0.70

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
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Product Lifecycle

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Feb 4, 2015

- 1341_CANCELLATION

ASSEMBLY

MAX3207EAUT+

PRODUCTION

MAX3207EAUT+T

PRODUCTION

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ASSEMBLY

MAX3207EAUT+

PRODUCTION

MAX3207EAUT+T

PRODUCTION

Software & Part Ecosystem

Evaluation Kits 2

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AD-PAARRAY3552R-SL

RF Front-end GaN Power Amplifier Biasing, Protection, and Control Reference Design

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AD-PAARRAY3552R-SL

RF Front-end GaN Power Amplifier Biasing, Protection, and Control Reference Design

RF Front-end GaN Power Amplifier Biasing, Protection, and Control Reference Design

Features and Benefits

  • Designed to cover full Tx signal chains with integrated MCU and user-friendly GUI for faster and easier integration
  • Supports fault event protection - overvoltage (OV), overcurrent (OC), and overtemperature (OT)
  • Supports ultrafast sub-µs GaN gate voltage switching ~ (<1 µs)
  • Supports ultrafast (<10 µs) fault event protection from detection up to GaN gate pinch-off
  • Wide range of gate bias voltages from -10 V to +10 V
  • Configurable power-up and power-down sequence

Product Detail

The AD-PAARRAY3552R-SL reference design provides control, protection, and proper biasing sequence for GaN power amplifier (PA) arrays. The design incorporates the AD3553R high-speed, dual-channel, 16-bit DAC to support the ultrafast sub-µs voltage settling time of GaN gates.

Key fault events, including overvoltage, overcurrent, and overtemperature, are effectively managed by the LTC7000, a static switch driver responsible for system fault protection.

The on-board MAX32666 ultralow-power ARM® Cortex®-M4 microprocessor provides essential debug and programming features for a comprehensive software development experience with the system. The system's firmware is built on ADI's open-source no-OS framework and includes a user-friendly graphical interface (GUI) for evaluation. Updates are easily applied through an SWD UART bootloader, streamlining prototyping.

The system can be powered by an external +48 V supply, requiring high current capabilities.

APPLICATIONS

  • 5G massive MIMOs
  • Macro base stations
Specifications
Fault Events
Fault Default Limit
Overvoltage +55 V
Overcurrent 3.5 A
Overtemperature 75°C
Output Ports
Port Name No. of ports
GaN gate ports 6
+48 V Gan drain ports 4
+5 V ports 5
Enable ports 2
Power Supply
External +48 V DC at 5 A
Operating Conditions
Temperature Range 45°C to +75°C
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EVAL-ISOMAX

Low-cost Integrated BMS Monitor with On-board MCU and Dual isoSPI

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EVAL-ISOMAX

Low-cost Integrated BMS Monitor with On-board MCU and Dual isoSPI

Low-cost Integrated BMS Monitor with On-board MCU and Dual isoSPI

Features and Benefits

  • Low-cost integrated monitoring for BMS with on-board MCU and dual isoSPI chip
  • Demonstrates SPI to isoSPI 2-wire datalinks
  • Includes two isoSPi ports for reversible isoSPI support
  • Configurable powering options for LPCM support isoSPI connections through simple DuraClik connectors
  • Stackable and allows daisy chain of up to eight (8) ADBMS6830BMSW boards
  • With PC-based software for control and data analysis using Broad Market Browser BMS GUI

Product Detail

The EVAL-ISOMAX is an integrated dual isoSPI adapter and microcontroller board featuring the MAX32670 high-reliability, ultralow power microcontroller and the ADBMS6822 dual isoSPI transceiver. This board allows multiple ADBMS68xx battery monitors to be connected through daisy-chain configuration. The EVAL-ISOMAX also features reversible isoSPI, which enables a redundant path to the peripheral units. The PCB components and DuraClik connectors are optimized for low electromagnetic interference (EMI) susceptibility and emissions.

APPLICATIONS

  • IOT Battery Management
  • Industrial Machine Vision
  • Power Tools
  • Mobile Robotics Battery Management
  • Industrial Equipment Battery Monitoring
  • Adaptive Battery Type System Monitoring
  • Portable Energy Storage Systems
  • Electric 2-Wheelers (E2Ws) such as E-scooter, E-bikes
  • Light Electric Vehicles (LEV)

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