Products
MAX3206E
RECOMMENDED FOR NEW DESIGNSLow-Capacitance, 2/3/4/6-Channel, ±15kV ESD-Protection Arrays for High-Speed Data Interfaces
Lowest Capacitance 2-/3-/4-/6-Channel ESD-Protection Arrays in WLP
- Part Models
- 4
- 1ku List Price
- Starting From $1.89
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Overview
- High-Speed Data Line ESD Protection
- ±15kV—Human Body Model
- ±8kV—IEC 61000-4-2, Contact Discharge
- ±15kV—IEC 61000-4-2, Air-Gap Discharge
- Tiny WLP Package Available
- Low 5pF Input Capacitance
- Low 1nA (max) Leakage Current
- Low 1nA Supply Current
- +0.9V to +5.5V Supply Voltage Range
- 2-, 3-, 4-, or 6-Channel Devices Available
The MAX3202E/MAX3203E/MAX3204E/MAX3206E are low-capacitance ±15kV ESD-protection diode arrays designed to protect sensitive electronics attached to communication lines. Each channel consists of a pair of diodes that steer ESD current pulses to VCC or GND. The MAX3202E/MAX3203E/MAX3204E/MAX3206E protect against ESD pulses up to ±15kV Human Body Model, ±8kV Contact Discharge, and ±15kV Air-Gap Discharge, as specified in IEC 61000-4-2. These devices have a 5pF capacitance per channel, making them ideal for use on high-speed data I/O interfaces.
The MAX3202E is a two-channel device intended for USB and USB 2.0 applications. The MAX3203E is a triple-ESD structure intended for USB On-the-Go (OTG) and video applications. The MAX3204E is a quad-ESD structure designed for Ethernet and FireWire® applications, and the MAX3206E is a six-channel device designed for cell phone connectors and SVGA video connections.
All devices are available in tiny 4-bump (1.05mm x 1.05mm) WLP, 6-bump (1.05mm x 1.57mm) WLP, 9-bump (1.52mm x 1.52mm) WLP, 6-pin (3mm x 3mm) TDFN, and 12-pin (4mm x 4mm) TQFN packages and are specified for -40°C to +85°C operation.
Applications
- Cell Phones
- Ethernet
- FireWire®
- SVGA Video Connections
- Universal Serial Bus (USB)
- USB 2.0
- Video
Documentation
Data Sheet 1
Technical Articles 2
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX3206EETC+ | Thin Quad Flatpack, No Leads | ||
| MAX3206EETC+T | Thin Quad Flatpack, No Leads | ||
| MAX3206EEWL+ | Wafer-Level Package 3x3 Bump, Depopulated | ||
| MAX3206EEWL+T | Wafer-Level Package 3x3 Bump, Depopulated |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Jun 20, 2016 - 1612 ASSEMBLY |
||
| MAX3206EETC+ | PRODUCTION | |
| MAX3206EETC+T | PRODUCTION | |
|
Apr 20, 2026 - 2571D PIN/ERRATA |
||
| MAX3206EETC+T | PRODUCTION | |
|
Dec 21, 2016 - 1671A ASSEMBLY |
||
| MAX3206EEWL+T | PRODUCTION | |
|
Jul 19, 2016 - 1594_AMENDED ASSEMBLY |
||
| MAX3206EEWL+T | PRODUCTION | |
|
Dec 8, 2015 - 1594_PRE-PCN WAFER FAB |
||
| MAX3206EEWL+T | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
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