Overview
Features and Benefits
- Protects Battery-Connected Modules with Minimal Power Consumption
- Wide Operating Input Voltage: +2.1V to +5.5V
- 4.5A Continuous Current Capability
- Integrated 15mΩ (typ) pFET
- Ultra-Low Supply Current: 13μA (typ)
- Allows Precise Design in OVLO Implementation
- Preset Accurate Internal OVP Thresholds
- MAX14736: 4.7V ±2.0%
- MAX14737: 5.2V ±2.0%
- Increases System Reliability Through Premium Security
- Surge Immunity to ±35V
- Soft-Start to Minimize Inrush Current
- Output Hot Plug-In Protection
- Thermal Shutdown
- Ultra-Fast OVP Response Time: 200ns (typ)
- Minimizes Board Space by Compact WLP
- 9-Bump 1.34mm x 1.36mm WLP
Product Details
The MAX14736/MAX14737 overvoltage-protection (OVP) devices guard battery-powered modules in portable devices against overvoltage faults. The low 15mΩ (typ) on-resistance, as well as the low 13µA (typ) quiescent supply current of the devices, minimize power consumption, making them an ideal choice for low-power systems. Additionally, the devices feature a precision overvoltage-lockout (OVLO) threshold, ultra-fast response time, and surge suppression to ±35V, which serve to provide excellent protection against even high slew-rate, high-voltage transients.
The integrated power transistor in the devices is a p-channel device, but the intrinsic body diode from OUT to IN is removed through appropriate design techniques. Consequently, when the switch is in the off state, reverse-current blocking that is inherent to the devices. The MAX14736/MAX14737 feature a push-pull POK output, which is driven low if either an overvoltage, undervoltage, or thermal fault is detected; or if the device is placed into shutdown mode.
The MAX14736 has an active-low enable pin (EN), while the enable pin (EN) on the MAX14737 is active high.
When the enable pin is driven to the active state, the device is enabled. When driven to the inactive state, the device is placed in a low-power shutdown mode and the switch is kept in the off state.
The MAX14736/MAX14737 are offered in a small, 9-bump (1.34mm x 1.36mm) wafer-level package (WLP) and operate over the -40°C to +85°C extended temperature range.
Applications
- e-Readers
- Smartphones
- Tablet PCs
Product Lifecycle
Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
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