Overview
Features and Benefits
- Versatile Jack Detection and Control
- MODE Three-State Microphone Bias Control
- MIC Switch Ground Detection (MAX14627)
- MIC Switch Open and Ground Detection (MAX14628)
- Compatible with Windows Mobile 7 and Google Android
- Microphone Button Press Detection
- High-Performance MIC Bias and Power Savings
- No Pop-Up Noises
- Ultra-Low Noise, High-PSRR MIC Bias
- Low-Power MIC Idle Mode
- Automatic Ultra-Low-Power Mode When Microphone Is Disabled
- PCB Space and Cost Savings
- Integrated ±15kV ESD Protection (HBM) on DETIN and MIC Input Terminals
- Small 8-Pin (2mm x 2mm) TDFN Package
Product Details
The MAX14627/MAX14628 provide a simple solution for detecting the insertion and managing the operation of a 3.5mm stereo headset with a microphone. These devices integrate all circuitry needed to detect SEND/END button press events and generate required microphone bias voltages, and are fully compatible with Windows® Mobile 7.
The devices need only three GPIOs from the host controller to select between call mode and standby mode, and monitor the SEND/END and jack insertion status. In call mode, the low-noise LDO is enabled to provide DC bias to the externally preamplified microphone. In standby mode, microphone low-power pulsing is enabled to reduce supply current while waiting for a SEND/END button press event. Two open-drain outputs signal the host controller when an insertion/removal or SEND/END button press event occurs. If a 3P headset without a microphone is inserted, the low-power pulsing can be disabled by setting the MODE input to high impedance.
The MAX14627 operates from a 2.5V to 5.5V input voltage supply and features an internal 2.2V LDO output, while the MAX14628 operates from a 3.1V to 5.5V voltage supply and features an internal 2.8V LDO output voltage. Both devices control jack insertion detection by monitoring a 3.5mm socket with a normally open jack insertion switch. Additionally, the MAX14628 features open microphone detection.
The MAX14627/MAX14628 are available in an 8-pin TDFN package, and are fully specified over the -40°C to +85°C extended temperature range.
Applications
- Cell Phones
- Portable Media Players
- Tablet/Laptop PCs
Product Categories
Product Lifecycle
Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Documentation & Resources
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
---|---|---|---|---|
MAX14628ETA+ | Material Declaration | Reliability Data | Thin Dual Flatpack No Leads, Exposed Pad | |
MAX14628ETA+T | Material Declaration | Reliability Data | Thin Dual Flatpack No Leads, Exposed Pad | |
Wafer Fabrication Data |
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