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  5. ADSP-21061L


Overview

Features and Benefits

  • 50MHz (20ns instruction rate) SISD SHARC Core
  • 150MFLOPs peak performance
  • Code compatible with all SHARC processors
  • Supports IEEE-compatible 32-bit floating-point, 40-bit floating point, and 32-bit fixed point math
  • 1Mbit of on-chip dual-ported SRAM
  • Glueless connection for scalable DSP multiprocessing
  • Two synchronous serial ports with independent transmit and receive functions
  • 6 Channel DMA controller
  • Host Processor Interface

Product Details

The ADSP-21061L is the newest member of the powerful SHARC® family of floating point processors. The SHARC® are signal processing microcomputers that offer new capabilities and levels of integration and performance. The ADSP-21061L is the low power (3.3 volt) version of the ADSP-21061. The ADSP-21061L is a 32-bit processor optimized for high performance DSP applications. The ADSP-21061L combines the ADSP-21000 DSP core with a dual-ported on-chip SRAM and an I/O processor with a dedicated I/O bus to form a complete system-in-a-chip.

Fabricated in a high-speed, low-power CMOS process, the ADSP-21061L has a 25 ns instruction cycle time operating at 40 MIPS. With its on-chip instruction cache, the processor can execute every instruction in a single cycle.

The ADSP-21061L SHARC combines a high-performance floating-point DSP core with integrated, on-chip system features, including a 1 Mbit SRAM memory, host processor interface, DMA controller, serial ports and parallel bus connectivity for glueless DSP multiprocessing.

Product Lifecycle icon-not-recommended Not Recommended for New Designs

This designates products ADI does not recommend broadly for new designs.

Documentation & Resources

  • View All (44)
  • Data Sheet (1)
  • Application Note (38)
  • Processor Manual (2)
  • Integrated Circuit Anomaly (1)
  • Legacy Emulator Manual (2)
  • Application Note

    Software & Systems Requirements

    Software & Tools Anomaly

    Tools & Simulations

    IBIS Model

    ADSP-21061L IBIS Datafile (BGA Package)

    [IBIS Ver]2.1,[File Rev]1.1,[Date]12/02/98

    BSDL Model File

    Designing with BGA

    Surface Mount Assembly Recommendations for Plastic Ball Grid Array (PBGA) Packages

    ADSP-21061L: PQFP (EDQUAD) package

    [BSDL] Created 01/08/99

    Design Resources

    ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well.  "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.

    Part Number Material Declaration Reliability Data Pin/Package Drawing CAD Symbols, Footprints & 3D Models
    ADSP-21061LASZ-176 Material Declaration Reliability Data 240-Lead MQFP
    ADSP-21061LKBZ-160 Material Declaration Reliability Data 225-Ball PBGA (23mm x 20mm)
    ADSP-21061LKSZ-160 Material Declaration Reliability Data 240-Lead MQFP
    Wafer Fabrication Data

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