ADGS1209

The EVAL-ADGS1208SDZ/EVAL-ADGS1209SDZ are the evaluation boards for the ADGS1208/ADGS1209. The ADGS1208/ADGS1209 are low on capacitance (CON), low charge injection (QINJ), 8:1/dual 4:1 multiplexers controlled by a serial peripheral interface (SPI). The SPI has robust error detection features, including cyclic redundancy check (CRC) error detection, invalid read/write address detection, and serial clock (SCLK) count error detection. It is possible to daisy-chain multiple ADGS1208/ADGS1209 devices together to enable the configuration of multiple devices with a minimal amount of digital lines. The ADGS1208/ADGS1209 also support burst mode, which decreases the time between SPI commands.

The EVAL-ADGS1208SDZ/ EVAL-ADGS1209SDZ are controlled by the EVAL-SDP-CB1Z system demonstration platform (SDP), which connects to a PC via a USB port. The ADGS1208 or ADGS1209 is on the center of the evaluation board, and wire screw terminals are provided to connect to each source and drain pin. Three screw terminals power the device and, if required, a fourth terminal provides users with a defined digital logic supply voltage. Alternatively, the digital logic supply voltage can be supplied from the SDP.

Consult the ADGS1208/ADGS1209 data sheet (available from Analog Devices, Inc.) in conjunction with User Guide UG-1271. The evaluation board interfaces to the USB port of a PC via the SDP board. The EVAL-SDP-CB1Z board (SDP-B controller board) is available for order at www.analog.com/SDP-B.

• 24-lead, 4 mm × 4 mm LFCSP evaluation board
• Easily changeable socket for the main device
• Gold pin connectors for the addition of passive components
• SMB connectors for the input and output of signals
• Additional space on board for prototyping

The EVAL-24LFCSPEBZ enables easy evaluation of the 24-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio portfolio that are purchased separately. The EVAL-24LFCSPEBZ is supplied with a socket to secure a 24-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, allowing board flexibility and reusability for multiple evaluations.

Figure 1 shows the EVAL-24LFCSPEBZ. A 24-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding 3-pin header link, from K1 to K24, that can either be connected to an external signal source by removing the corresponding link or by using the link to choose between VDD or GND. A wire screw terminal, J1, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-24LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 24-lead LFCSP pads (4 mm × 4 mm) available on top of the EVAL-24LFCSPEBZ for prototyping.

The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-24LFCSPEBZ user guide when using the EVAL-24LFCSPEBZ.