ADG888
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ADG888

0.4 Ω CMOS, Dual DPDT Switch in WLCSP/LFCSP/TSSOP

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Info: : PRODUCTION tooltip
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Part Details
Part Models 5
1ku List Price Starting From $1.97
Features
  • 1.8 V to 5.5 V operation
  • Ultralow on resistance
    • 0.4 Ω typical
    • 0.6 Ω maximum at 5 V supply
  • Excellent audio performance, ultralow distortion
    • 0.07 Ω typical
    • 0.14 Ω maximum RON flatness
  • High current carrying capability
    • 400 mA continuous
  • 600 mA peak current at 5 V
  • Automotive temperature range: −40°C to +125°C
  • Rail-to-rail switching operation
  • Typical power consumption (<0.1 μW)
Additional Details
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The ADG888 is a low voltage, dual DPDT (double-pole, double-throw) CMOS device optimized for high performance audio switching. With its low power and small physical size, it is ideal for portable devices.

This device offers ultralow on resistance of less than 0.8 Ω over the full temperature range, making it an ideal solution for applications requiring minimal distortion through the switch. The ADG888 also has the capability of carrying large amounts of current, typically 400 mA at 5 V operation.

When on, each switch conducts equally well in both directions and has an input signal range that extends to the supplies. The ADG888 exhibits break-before-make switching action.

The ADG888 is available in a 16-ball WLCSP, 16-lead LFCSP, and a 16-lead TSSOP. These packages make the ADG888 the ideal solution for space-constrained applications.

Product Highlights

  1. <0.6 Ω over full temperature range of −40°C to +125°C.
  2. High current handling capability (400 mA continuous current at 5 V).
  3. Low THD + N (0.008% typical).
  4. Tiny 16-ball WLCSP, 16-lead LFCSP, and 16-lead TSSOP.

Applications

  • Cellular phones 
  • PDAs 
  • MP3 players 
  • Power routing 
  • Battery-powered systems 
  • PCMCIA cards 
  • Modems 
  • Audio and video signal routing 
  • Communication systems 
  • Data switching
Part Models 5
1ku List Price Starting From $1.97

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG888BCBZ-REEL7
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ADG888YCPZ-REEL7
  • HTML
  • HTML
ADG888YRUZ
  • HTML
  • HTML
ADG888YRUZ-REEL
  • HTML
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ADG888YRUZ-REEL7
  • HTML
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Product Lifecycle

PCN

Feb 28, 2012

- 11_0175

Shipping Changes for WLCSP Products with 8mm Carrier Tape Width

Feb 8, 2010

- 04_0080

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

ADG888BCBZ-REEL7

PRODUCTION

ADG888YCPZ-REEL7

PRODUCTION

ADG888YRUZ

PRODUCTION

ADG888YRUZ-REEL7

PRODUCTION

May 5, 2014

- 14_0020

Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Apr 5, 2021

- 21_0035

Amkor Philippines as an Alternate Site for TSSOP_4.4

ADG888YRUZ

PRODUCTION

ADG888YRUZ-REEL

PRODUCTION

ADG888YRUZ-REEL7

PRODUCTION

Jan 20, 2012

- 11_0218

Halogen Free Material Change for Certain TSSOP Products at Carsem

ADG888YRUZ

PRODUCTION

ADG888YRUZ-REEL

PRODUCTION

ADG888YRUZ-REEL7

PRODUCTION

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Feb 28, 2012

- 11_0175

arrow down

Shipping Changes for WLCSP Products with 8mm Carrier Tape Width

Feb 8, 2010

- 04_0080

arrow down

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

ADG888BCBZ-REEL7

PRODUCTION

ADG888YCPZ-REEL7

PRODUCTION

ADG888YRUZ

PRODUCTION

ADG888YRUZ-REEL7

PRODUCTION

May 5, 2014

- 14_0020

arrow down

Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Apr 5, 2021

- 21_0035

arrow down

Amkor Philippines as an Alternate Site for TSSOP_4.4

ADG888YRUZ

PRODUCTION

ADG888YRUZ-REEL

PRODUCTION

ADG888YRUZ-REEL7

PRODUCTION

Jan 20, 2012

- 11_0218

arrow down

Halogen Free Material Change for Certain TSSOP Products at Carsem

ADG888YRUZ

PRODUCTION

ADG888YRUZ-REEL

PRODUCTION

ADG888YRUZ-REEL7

PRODUCTION

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 2

EVAL-ADG888

ADG888 Evaluation Board

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EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

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EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Features and Benefits

  • 16-lead, 4 mm × 4 mm LFCSP evaluation board
  • Easily changeable clamshell socket for the main device
  • Gold pin connectors for the addition of passive components
  • SMB connectors for the input and output of signals
  • Additional space on board for prototyping

Product Detail

The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.

Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.

The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.

Tools & Simulations

Tools & Simulations 1

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

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