Features and Benefits
- 1.8 V to 5.5 V operation
- Ultralow on resistance
- 0.4 Ω typical
- 0.6 Ω maximum at 5 V supply
- Excellent audio performance, ultralow distortion
- 0.07 Ω typical
- 0.14 Ω maximum RON flatness
- High current carrying capability
- 400 mA continuous
- 600 mA peak current at 5 V
- Automotive temperature range: −40°C to +125°C
- Rail-to-rail switching operation
- Typical power consumption (<0.1 μW)
The ADG888 is a low voltage, dual DPDT (double-pole, double-throw) CMOS device optimized for high performance audio switching. With its low power and small physical size, it is ideal for portable devices.
This device offers ultralow on resistance of less than 0.8 Ω over the full temperature range, making it an ideal solution for applications requiring minimal distortion through the switch. The ADG888 also has the capability of carrying large amounts of current, typically 400 mA at 5 V operation.
When on, each switch conducts equally well in both directions and has an input signal range that extends to the supplies. The ADG888 exhibits break-before-make switching action.
The ADG888 is available in a 16-ball WLCSP, 16-lead LFCSP, and a 16-lead TSSOP. These packages make the ADG888 the ideal solution for space-constrained applications.
- <0.6 Ω over full temperature range of −40°C to +125°C.
- High current handling capability (400 mA continuous current at 5 V).
- Low THD + N (0.008% typical).
- Tiny 16-ball WLCSP, 16-lead LFCSP, and 16-lead TSSOP.
- Cellular phones
- MP3 players
- Power routing
- Battery-powered systems
- PCMCIA cards
- Audio and video signal routing
- Communication systems
- Data switching
Product Lifecycle Production
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
Evaluation Kits (2)
The ADG888 evaluation board allows designers to evaluate the high-performance Dual DPDT switches with a minimum of effort. There is a test point on each audio jack, as well as the two logic control inputs, to check voltage level is entering/exiting each pin.
The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.
Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.
The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.
Documentation & Resources
Tools & Simulations
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.
Models for the following parts are available in LTspice:
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|ADG888BCBZ-REEL7||Material Declaration||Reliability Data||16-Ball WLCSP (2mm x 2mm x 0.59mm)|
|ADG888YCPZ-REEL7||Material Declaration||Reliability Data||16-Lead LFCSP (4mm x 4mm w/ EP)|
|ADG888YRUZ||Material Declaration||Reliability Data||16-Lead TSSOP|
|ADG888YRUZ-REEL||Material Declaration||Reliability Data||16-Lead TSSOP|
|ADG888YRUZ-REEL7||Material Declaration||Reliability Data||16-Lead TSSOP|
|Wafer Fabrication Data|
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Sample & Buy
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