ADG5413
Info : RECOMMENDED FOR NEW DESIGNS
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ADG5413

High Voltage Latch-Up Proof, Quad SPST Switches

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 3
1ku List Price Starting From $2.57
Features
  • Latch-up proof
  • 8 kV human body model (HBM) ESD rating
  • Low on resistance (<10 Ω)
  • ±9 V to ±22 V dual-supply operation
  • 9 V to 40 V single-supply operation
  • 48 V supply maximum ratings
  • Fully specified at ±15 V, ±20 V, +12 V, and +36 V
  • VSS to VDD analog signal range
Additional Details
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The ADG5412/ADG5413 contain four independent single-pole/single-throw (SPST) switches. The ADG5412 switches turn on with Logic 1. The ADG5413 has two switches with digital control logic similar to that of the ADG5412; however, the logic is inverted on the other two switches. Each switch conducts equally well in both directions when on, and each switch has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked.

The ADG5412 and ADG5413 do not have a VL pin. The digital inputs are compatible with 3 V logic inputs over the full operating supply range.

The on-resistance profile is very flat over the full analog input range, which ensures good linearity and low distortion when switching audio signals. High switching speed also makes the devices suitable for video signal switching. The ADG5413 exhibits break-before-make switching action for use in multiplexer applications.

Product Highlights

  1. Trench isolation guards against latch-up. A dielectric trench separates the P and N channel transistors thereby preventing latch-up even under severe overvoltage conditions.
  2. Low RON.
  3. Dual-supply operation. For applications where the analog signal is bipolar, the ADG5412/ADG5413 can be operated from dual supplies up to ±22 V.
  4. Single-supply operation. For applications where the analog signal is unipolar, the ADG5412/ADG5413 can be operated from a single rail power supply up to 40 V.
  5. 3 V logic compatible digital inputs: VINH = 2.0 V, VINL = 0.8 V.
  6. No VL logic power supply required.

Applications

  • Relay replacement
  • Automatic test equipment
  • Data acquisition
  • Instrumentation
  • Avionics
  • Audio and video switching
  • Communication systems
Part Models 3
1ku List Price Starting From $2.57

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG5413BCPZ-REEL7
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ADG5413BRUZ
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ADG5413BRUZ-REEL7
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Part Models

Product Lifecycle

PCN

Jul 17, 2023

- 23_0095

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Aug 12, 2022

- 21_0271

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Sep 26, 2017

- 17_0145

ADG5412/ADG5413, ADG5404, and ADG5436 Datasheet Specification Change

ADG5413BCPZ-REEL7

PRODUCTION

ADG5413BRUZ

PRODUCTION

ADG5413BRUZ-REEL7

PRODUCTION

Oct 18, 2016

- 16_0036

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Sep 29, 2014

- 13_0248

Assembly and Test Transfer of Select 4x4 and 5x5mm LFCSP Products using 8900 Die Attach to STATS ChipPAC China

Jun 7, 2011

- 11_0115

ADG5412/ADG5413/ADG5436/ADG5404/ADG5408/ADG5409/ADG5433/ADG5434 N-plug layer Edits

ADG5413BCPZ-REEL7

PRODUCTION

ADG5413BRUZ

PRODUCTION

ADG5413BRUZ-REEL7

PRODUCTION

Apr 5, 2021

- 21_0035

Amkor Philippines as an Alternate Site for TSSOP_4.4

Jan 20, 2012

- 11_0218

Halogen Free Material Change for Certain TSSOP Products at Carsem

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Jul 17, 2023

- 23_0095

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Aug 12, 2022

- 21_0271

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Sep 26, 2017

- 17_0145

arrow down

ADG5412/ADG5413, ADG5404, and ADG5436 Datasheet Specification Change

ADG5413BCPZ-REEL7

PRODUCTION

ADG5413BRUZ

PRODUCTION

ADG5413BRUZ-REEL7

PRODUCTION

Oct 18, 2016

- 16_0036

arrow down

Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products

Sep 29, 2014

- 13_0248

arrow down

Assembly and Test Transfer of Select 4x4 and 5x5mm LFCSP Products using 8900 Die Attach to STATS ChipPAC China

Jun 7, 2011

- 11_0115

arrow down

ADG5412/ADG5413/ADG5436/ADG5404/ADG5408/ADG5409/ADG5433/ADG5434 N-plug layer Edits

ADG5413BCPZ-REEL7

PRODUCTION

ADG5413BRUZ

PRODUCTION

ADG5413BRUZ-REEL7

PRODUCTION

Apr 5, 2021

- 21_0035

arrow down

Amkor Philippines as an Alternate Site for TSSOP_4.4

Jan 20, 2012

- 11_0218

arrow down

Halogen Free Material Change for Certain TSSOP Products at Carsem

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 2

reference details image

EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

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EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Features and Benefits

  • 16-lead, 4 mm × 4 mm LFCSP evaluation board
  • Easily changeable clamshell socket for the main device
  • Gold pin connectors for the addition of passive components
  • SMB connectors for the input and output of signals
  • Additional space on board for prototyping

Product Detail

The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.

Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.

The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.

reference details image

EVAL-16TSSOP

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

zoom

EVAL-16TSSOP

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

Features and Benefits

  • 16 lead TSSOP evaluation board
  • Clamp to allow the main device to be changed easily
  • Gold pin connectors to allow the addition of passive components
  • SMB connectors for the input/output of signals
  • Additional space on board to allow for prototyping

Product Detail

The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.

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