ADG5234
High Voltage Latch-Up Proof, Quad SPDT Switches
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Features
- Latch-up proof
- 2.8 pF off source capacitance
- 9 pF off drain capacitance
- 0.4 pC charge injection
- Low on resistance: 160 Ω typical
- ±9 V to ±22 V dual-supply operation
- 9 V to 40 V single-supply operation
- 48 V supply maximum ratings
- Fully specified at ±15 V, ±20 V, +12 V, and +36 V
- VDD to VSS analog signal range
- Human body model (HBM) ESD rating
8 kV input/output port to supplies
2 kV input/output port to input/output port
8 kV all other pins
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The ADG5233 and ADG5234 are monolithic industrial CMOS analog switches comprising three independently selectable single-pole, double throw (SPDT) switches and four independently selectable SPDT switches, respectively.
All channels exhibit break-before-make switching action that prevents momentary shorting when switching channels. An EN input on the ADG5233 (LFCSP and TSSOP packages) is used to enable or disable the device. When disabled, all channels are switched off.
The ultralow capacitance and charge injection of these switches make them ideal solutions for data acquisition and sample-and-hold applications, where low glitch and fast settling are required. Fast switching speed coupled with high signal bandwidth make these devices suitable for video signal switching.
APPLICATIONS
- Automatic test equipment
- Data acquisition
- Instrumentation
- Avionics
- Audio and video switching
- Communication systems
PRODUCT HIGHLIGHTS
- Trench Isolation Guards Against Latch-Up. A dielectric trench separates the P and N channel transistors thereby preventing latch-up even under severe overvoltage conditions.
- Ultralow Capacitance and −0.6 pC Charge Injection.
- Dual-Supply Operation. For applications where the analog signal is bipolar, the ADG5233/ADG5234 can be operated from dual supplies up to ±22 V.
- Single-Supply Operation. For applications where the analog signal is unipolar, the ADG5233/ADG5234 can be operated from a single-rail power supply up to 40 V.
- 3 V Logic-Compatible Digital Inputs. VINH = 2.0 V, VINL = 0.8 V.
- No VL Logic Power Supply Required.
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ADG5234
Documentation
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Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG5234BCPZ-RL7 |
20-Lead LFCSP (4mm x 4mm w/ EP)
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| ADG5234BRUZ |
20-Lead TSSOP
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| ADG5234BRUZ-RL7 |
20-Lead TSSOP
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- ADG5234BCPZ-RL7
- Pin/Package Drawing
-
20-Lead LFCSP (4mm x 4mm w/ EP)
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- ADG5234BRUZ
- Pin/Package Drawing
-
20-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG5234BRUZ-RL7
- Pin/Package Drawing
-
20-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Jul 17, 2023
- 23_0095
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADG5234BCPZ-RL7
PRODUCTION
Aug 12, 2022
- 21_0271
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADG5234BCPZ-RL7
PRODUCTION
Oct 18, 2016
- 16_0036
Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Jul 30, 2015
- 15_0160
ADG5233 and ADG5234 LFCSP Redesign resulting in Data Sheet Specification Changes
ADG5234BCPZ-RL7
PRODUCTION
Aug 6, 2014
- 13_0230
Assembly and Test Transfer of Select 3.5x3.5, 4x3, 4x4, and 5x5mm LFCSP Products to STATS ChipPAC China
Jul 23, 2015
- 14_0066
ADG5233 and ADG5234 TSSOP Redesign resulting in Data Sheet Specification Changes
ADG5234BRUZ
PRODUCTION
ADG5234BRUZ-RL7
PRODUCTION
Jul 23, 2014
- 13_0241
Qualification of ASE Chungli as an Alternate Assembly Site for Select 16L, 20L and 24L TSSOP Packages
ADG5234BRUZ
PRODUCTION
ADG5234BRUZ-RL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG5234BRUZ
PRODUCTION
ADG5234BRUZ-RL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Jul 17, 2023
- 23_0095
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADG5234BCPZ-RL7
PRODUCTION
Aug 12, 2022
- 21_0271
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADG5234BCPZ-RL7
PRODUCTION
Oct 18, 2016
- 16_0036
Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Jul 30, 2015
- 15_0160
ADG5233 and ADG5234 LFCSP Redesign resulting in Data Sheet Specification Changes
ADG5234BCPZ-RL7
PRODUCTION
Aug 6, 2014
- 13_0230
Assembly and Test Transfer of Select 3.5x3.5, 4x3, 4x4, and 5x5mm LFCSP Products to STATS ChipPAC China
Jul 23, 2015
- 14_0066
ADG5233 and ADG5234 TSSOP Redesign resulting in Data Sheet Specification Changes
ADG5234BRUZ
PRODUCTION
ADG5234BRUZ-RL7
PRODUCTION
Jul 23, 2014
- 13_0241
Qualification of ASE Chungli as an Alternate Assembly Site for Select 16L, 20L and 24L TSSOP Packages
ADG5234BRUZ
PRODUCTION
ADG5234BRUZ-RL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG5234BRUZ
PRODUCTION
ADG5234BRUZ-RL7
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 1
EVAL-24TSSOP
Evaluation Board for 24-Lead TSSOP Devices in the Switches and Multiplexers Portfolio
Product Detail
The EVAL-24TSSOPEBZ evaluation board evaluates 24-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-24TSSOPEBZ to secure a 24-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.
A 24-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K24 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
Tools & Simulations 1
IBIS Model 2
IBIS Model
