ADG5213
High Voltage Latch-Up Proof, Quad SPST Switches
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Features
- Latch-up proof
- 3 pF off source capacitance
- 5 pF off drain capacitance
- 0.07 pC charge injection
- Low leakage: 0.2 nA maximum at 85ºC
- ±9 V to ±22 V dual-supply operation
- 9 V to 40 V single-supply operation
- 48 V supply maximum ratings
- Fully specified at ±15 V, ±20 V, +12 V, and +36 V
- VSS to VDD analog signal range
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The ADG5212 / ADG5213 contain four independent single-pole/single-throw (SPST) switches. The ADG5212 switches turn on with Logic 1. The ADG5213 has two switches with digital control logic similar to that of the ADG5212; however, the logic is inverted on the other two switches. Each switch conducts equally well in both directions when on, and each switch has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked.
The ADG5212 and ADG5213 do not have a VL pin. The digital inputs are compatible with 3 V logic inputs over the full operating supply range.
The ultralow capacitance and charge injection of these switches make them ideal solutions for data acquisition and sample-and-hold applications, where low glitch and fast settling are required. Fast switching speed together with high signal bandwidth make the parts suitable for video signal switching.
APPLICATIONS
- Automatic test equipment
- Data acquisition
- Instrumentation
- Avionics
- Audio and video switching
- Communication systems
PRODUCT HIGLIGHHTS
- Trench Isolation Guards Against Latch-Up. A dielectric trench separates the P and N channel transistors thereby preventing latch-up even under severe overvoltage conditions.
- Ultralow capacitance and < 1 pC charge injection.
- Dual-Supply Operation. For applications where the analog signal is bipolar, the ADG5212 / ADG5213 can be operated from dual supplies up to ±22V.
- Single-Supply Operation. For applications where the analog signal is unipolar, the ADG5212 / ADG5213 can be operated from a single rail power supply up to 40 V.
- 3 V Logic Compatible Digital Inputs. VINH = 2.0 V, VINL = 0.8 V.
- No VL Logic Power Supply Required.
Ask a Question
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Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
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ADG5213
Documentation
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User Guide
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Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG5213BCPZ-RL7 |
16-Lead LFCSP (4mm x 4mm)
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|
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| ADG5213BRUZ |
16-Lead TSSOP
|
|
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| ADG5213BRUZ-RL7 |
16-Lead TSSOP
|
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- ADG5213BCPZ-RL7
- Pin/Package Drawing
-
16-Lead LFCSP (4mm x 4mm)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG5213BRUZ
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG5213BRUZ-RL7
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Jul 17, 2023
- 23_0095
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADG5213BCPZ-RL7
PRODUCTION
Aug 12, 2022
- 21_0271
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADG5213BCPZ-RL7
PRODUCTION
Oct 18, 2016
- 16_0036
Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Aug 28, 2015
- 15_0174
ADG5212/ADG5213 Data Sheet Update to Correct Off-isolation Specification
ADG5213BCPZ-RL7
PRODUCTION
ADG5213BRUZ
PRODUCTION
ADG5213BRUZ-RL7
PRODUCTION
Sep 29, 2014
- 13_0248
Assembly and Test Transfer of Select 4x4 and 5x5mm LFCSP Products using 8900 Die Attach to STATS ChipPAC China
Nov 12, 2013
- 13_0230
Assembly and Test Transfer of Select 3.5x3.5, 4x3, 4x4, and 5x5mm LFCSP Products to STATS ChipPAC China
ADG5213BCPZ-RL7
PRODUCTION
Apr 5, 2021
- 21_0035
Amkor Philippines as an Alternate Site for TSSOP_4.4
ADG5213BRUZ
PRODUCTION
ADG5213BRUZ-RL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG5213BRUZ
PRODUCTION
ADG5213BRUZ-RL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Jul 17, 2023
- 23_0095
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADG5213BCPZ-RL7
PRODUCTION
Aug 12, 2022
- 21_0271
Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages
ADG5213BCPZ-RL7
PRODUCTION
Oct 18, 2016
- 16_0036
Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC Singapore of Select LFCSP Products
Aug 28, 2015
- 15_0174
ADG5212/ADG5213 Data Sheet Update to Correct Off-isolation Specification
ADG5213BCPZ-RL7
PRODUCTION
ADG5213BRUZ
PRODUCTION
ADG5213BRUZ-RL7
PRODUCTION
Sep 29, 2014
- 13_0248
Assembly and Test Transfer of Select 4x4 and 5x5mm LFCSP Products using 8900 Die Attach to STATS ChipPAC China
Nov 12, 2013
- 13_0230
Assembly and Test Transfer of Select 3.5x3.5, 4x3, 4x4, and 5x5mm LFCSP Products to STATS ChipPAC China
ADG5213BCPZ-RL7
PRODUCTION
Apr 5, 2021
- 21_0035
Amkor Philippines as an Alternate Site for TSSOP_4.4
ADG5213BRUZ
PRODUCTION
ADG5213BRUZ-RL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG5213BRUZ
PRODUCTION
ADG5213BRUZ-RL7
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 2
EVAL-16LFCSP
Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio
Product Detail
The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.
Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.
The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.
EVAL-16TSSOP
Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio
Product Detail
The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.
A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
Tools & Simulations 1
SPICE Model 1
SPICE Model
