ADG509A
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ADG509A

CMOS 4-Channel Analog Multiplexer

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Part Details
Part Models 6
1ku List Price Starting From $3.70
Features
  • 44 V supply maximum rating
  • VSS to VDD analog signal range
  • Single-/dual-supply specifications
  • Wide supply range: 10.8 V to 16.5 V
  • Extended plastic temperature range: −40°C to +85°C
  • Low power dissipation: 28 mW maximum
  • Low leakage: 20 pA typical
  • Available in 16-lead DIP/SOIC and 20-lead PLCC/LCC packages
  • Superior alternative to
    DG508A, HI-508
    DG509A, HI-509
Additional Details
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The ADG508A and ADG509A are CMOS monolithic analog multiplexers with eight channels and dual four channels, respectively. The ADG508A switches one of eight inputs to a common output, depending on the state of three binary addresses and an enable input. The ADG509A switches one of four differential inputs to a common differential output, depending on the state of two binary addresses and an enable input. Both devices have TTL and 5 V CMOS logic-compatible digital inputs.

The ADG508A and ADG509A are designed on an enhanced LC2MOS process that gives an increased signal capability of VSS to VDD and enables operation over a wide range of supply voltages. The devices can comfortably operate anywhere in the 10.8 V to 16.5 V single- or dual-supply range. These multiplexers also feature high switching speeds and low RON.

PRODUCT HIGHLIGHTS

  1. Single-/Dual-Supply Specifications with a Wide Tolerance. The devices are specified in the 10.8 V to 16.5 V range for both single and dual supplies.
  2. Extended Signal Range. The enhanced LC2MOS processing results in a high breakdown and an increased analog signal range of VSS to VDD.
  3. Break-Before-Make Switching. Switches are guaranteed break-before-make so that input signals are protected against momentary shorting.
  4. Low Leakage. Leakage currents in the range of 20 pA make these multiplexers suitable for high precision circuits.
Part Models 6
1ku List Price Starting From $3.70

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG509AKNZ
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ADG509AKPZ-REEL
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ADG509AKRZ-REEL
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ADG509AKRZ-REEL7
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ADG509ATQ
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ADG509ATQ/883B
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Part Models

Product Lifecycle

PCN

Mar 29, 2021

- 21_0033

Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek

Feb 8, 2010

- 04_0080

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

ADG509AKNZ

ADG509AKRZ-REEL

ADG509AKRZ-REEL7

ADG509ATQ

PRODUCTION

ADG509ATQ/883B

PRODUCTION

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Feb 6, 2014

- 13_0234

Qualification of ASE Chungli, as an Alternate Assembly Site for Select 16L SOICN Packages

Oct 5, 2010

- 10_0146

Halogen Free Material Change for 14/16L SOIC_N Products

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

ADG509ATQ

PRODUCTION

ADG509ATQ/883B

PRODUCTION

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

ADG509ATQ

PRODUCTION

ADG509ATQ/883B

PRODUCTION

Apr 9, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Mar 29, 2021

- 21_0033

arrow down
Feb 8, 2010

- 04_0080

arrow down

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

ADG509AKNZ

ADG509AKRZ-REEL

ADG509AKRZ-REEL7

ADG509ATQ

PRODUCTION

ADG509ATQ/883B

PRODUCTION

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Feb 6, 2014

- 13_0234

arrow down

Qualification of ASE Chungli, as an Alternate Assembly Site for Select 16L SOICN Packages

Oct 5, 2010

- 10_0146

arrow down

Halogen Free Material Change for 14/16L SOIC_N Products

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

ADG509ATQ

PRODUCTION

ADG509ATQ/883B

PRODUCTION

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

ADG509ATQ

PRODUCTION

ADG509ATQ/883B

PRODUCTION

Apr 9, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

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Software & Part Ecosystem

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