ADG419
PRODUCTIONLC2MOS Precision Mini-DIP Analog Switch
- Part Models
- 9
- 1ku List Price
- Starting From $2.10
Part Details
- 44 V supply maximum ratings
- VSS to VDD analog signal range
- Low on resistance: <35 Ω
- Ultralow power dissipation: < 35 μW
- Fast transition time: 160 ns maximum
- Break-before-make switching action
- Plug-in replacement for DG419
ADG419-EP supports defense and aerospace applications (AQEC standard)
- Download ADG419-EP data sheet (pdf)
- Military temperature range: −55°C to +125°C
- Controlled manufacturing baseline
- One assembly/test site
- See Data Sheet for more information
The ADG419 is a monolithic CMOS SPDT switch. This switch is designed on an enhanced LC2MOS process that provides low power dissipation yet gives high switching speed, low on resistance, and low leakage currents.
The on resistance profile of the ADG419 is very flat over the full analog input range, ensuring excellent linearity and low distortion. The part also exhibits high switching speed and high signal bandwidth. CMOS construction ensures ultralow power dissipation, making the parts ideally suited for portable and battery-powered instruments.
Each switch of the ADG419 conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked. The ADG419 exhibits break-before-make switching action.
The ADG419-EP supports defense and aerospace applications (AQEC)
Applications
- Precision test equipment
- Precision instrumentation
- Battery-powered systems
- Sample-and-hold systems
Documentation
Data Sheet 3
User Guide 1
Technical Articles 3
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG419BNZ | 8-Lead PDIP | ||
| ADG419BRMZ | 8-Lead MSOP | ||
| ADG419BRMZ-REEL | 8-Lead MSOP | ||
| ADG419BRMZ-REEL7 | 8-Lead MSOP | ||
| ADG419BRZ | 8-Lead SOIC | ||
| ADG419BRZ-REEL | 8-Lead SOIC | ||
| ADG419BRZ-REEL7 | 8-Lead SOIC | ||
| ADG419SRMZ-EP-RL7 | 8-Lead MSOP | ||
| ADG419TQ | 8-Lead CerDIP |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland. |
||
| ADG419BNZ | ||
| ADG419BRMZ | ||
| ADG419BRMZ-REEL | ||
| ADG419BRMZ-REEL7 | ||
| ADG419BRZ | PRODUCTION | |
| ADG419BRZ-REEL | PRODUCTION | |
| ADG419BRZ-REEL7 | PRODUCTION | |
|
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
| ADG419BNZ | ||
|
Mar 22, 2021 - 21_0001 Addition of Amkor Philippines as an Alternate Site for Singulated MSOP and MSOP_EP |
||
| ADG419BRMZ | ||
| ADG419BRMZ-REEL | ||
| ADG419BRMZ-REEL7 | ||
|
Jan 5, 2015 - 14_0246 Qualification of ASE Chungli, as an Alternate Assembly Site for Select MSOP Devices |
||
| ADG419BRMZ | ||
| ADG419BRMZ-REEL | ||
| ADG419BRMZ-REEL7 | ||
|
May 15, 2012 - 10_0006 Halogen Free Material Change for mini SOIC Products |
||
| ADG419BRMZ | ||
| ADG419BRMZ-REEL | ||
| ADG419BRMZ-REEL7 | ||
| ADG419SRMZ-EP-RL7 | PRODUCTION | |
|
Jul 20, 2012 - 12_0105 Halogen Free Material Change for Select SOIC Narrow and Wide Body Products Assembled at Amkor |
||
| ADG419BRZ | PRODUCTION | |
| ADG419BRZ-REEL | PRODUCTION | |
| ADG419BRZ-REEL7 | PRODUCTION | |
|
Mar 11, 2019 - 18_0209 ADG419-EP Re-design with Wafer Fabrication Transfer |
||
| ADG419SRMZ-EP-RL7 | PRODUCTION | |
|
Jun 24, 2019 - 19_0113 ADG419TQ Re-design with Wafer Fabrication Transfer |
||
| ADG419TQ | PRODUCTION | |
|
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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| ADG419TQ | PRODUCTION | |
|
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
| ADG419TQ | PRODUCTION | |
|
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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| ADG419TQ | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Software Resources
Can't find the software or driver you need?
Request a Driver/SoftwareHardware Ecosystem
Tools & Simulations
LTspice
Models for the following parts are available in LTspice:
- ADG419
SPICE Model 1
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.
Evaluation Kits
Evaluation Board for 8 lead MSOP Devices in the Switch/Mux Portfolio