ADG2188
I2C® CMOS 8 × 8 Unbuffered Analog Switch Array with Dual/Single Supplies
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Features
- I2C-compatible interface
- 3.4 MHz high speed I2C option
- 32-lead LFCSP_WQ (5 mm × 5 mm)
- Double-buffered input logic
- Simultaneous update of multiple switches
- Up to 300 MHz bandwidth
- Fully specified at dual ±5 V/single +12 V operation
- On resistance 35 Ω maximum
- Low quiescent current < 20 μA
- Qualified for automotive applications
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The ADG2188 is an analog cross point switch with an array size of 8 × 8. The switch array is arranged so that there are eight columns by eight rows, for a total of 64 switch channels. The array is bidirectional, and the rows and columns can be configured as either inputs or outputs. Each of the 64 switches can be addressed and configured through the I2C-compatible interface. Standard, full speed, and high speed (3.4 MHz) I2C interfaces are supported. Any simultaneous switch combination is allowed. An additional feature of the ADG2188 is that switches can be updated simultaneously, using the LDSW command. In addition, a RESET option allows all of the switch channels to be reset/off. At power on, all switches are in the off condition. The device is packaged in a 32-lead, 5 mm × 5 mm LFCSP_WQ.
Applications
- AV switching in TV
- Automotive infotainment
- AV receivers
- CCTV
- Ultrasound applications
- KVM switching
- Telecom applications
- Test equipment/instrumentation
- PBX systems
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Search
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Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
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ADG2188
Documentation
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Data Sheet
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User Guide
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Documentation
Product Selection Guide 2
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG2188BCPZ-REEL7 |
32-Lead LFCSP (5mm x 5mm w/ EP)
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| ADG2188YCPZ-REEL7 |
32-Lead LFCSP (5mm x 5mm w/ EP)
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| ADW54012Z-0REEL7 |
32-Lead LFCSP (5mm x 5mm w/ EP)
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- ADG2188BCPZ-REEL7
- Pin/Package Drawing
-
32-Lead LFCSP (5mm x 5mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG2188YCPZ-REEL7
- Pin/Package Drawing
-
32-Lead LFCSP (5mm x 5mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADW54012Z-0REEL7
- Pin/Package Drawing
-
32-Lead LFCSP (5mm x 5mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
May 4, 2016
- 14_0178
Conversion of 3x3mm, 4x4mm and 5x5mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines
ADG2188BCPZ-REEL7
PRODUCTION
ADG2188YCPZ-REEL7
PRODUCTION
ADW54012Z-0REEL7
PRODUCTION
Apr 2, 2013
- 12_0063
Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.
ADG2188BCPZ-REEL7
PRODUCTION
ADG2188YCPZ-REEL7
PRODUCTION
Apr 12, 2010
- 09_0224
ADG2128, ADG2188, ADG2108, I2C interface change.
ADG2188BCPZ-REEL7
PRODUCTION
ADG2188YCPZ-REEL7
PRODUCTION
Nov 16, 2009
- 06_0157
Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
ADG2188BCPZ-REEL7
PRODUCTION
ADG2188YCPZ-REEL7
PRODUCTION
Feb 15, 2010
- 07_0061
LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
ADG2188YCPZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
May 4, 2016
- 14_0178
Conversion of 3x3mm, 4x4mm and 5x5mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines
ADG2188BCPZ-REEL7
PRODUCTION
ADG2188YCPZ-REEL7
PRODUCTION
ADW54012Z-0REEL7
PRODUCTION
Apr 2, 2013
- 12_0063
Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea.
ADG2188BCPZ-REEL7
PRODUCTION
ADG2188YCPZ-REEL7
PRODUCTION
Apr 12, 2010
- 09_0224
ADG2128, ADG2188, ADG2108, I2C interface change.
Nov 16, 2009
- 06_0157
Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
ADG2188BCPZ-REEL7
PRODUCTION
ADG2188YCPZ-REEL7
PRODUCTION
Feb 15, 2010
- 07_0061
LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
ADG2188YCPZ-REEL7
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 1
EVAL-ADG2188
ADG2188 Evaluation Board
Product Detail
The ADG2188 has a maximum difference of 15 V between the VDD and VSS inputs. Therefore, take care to not to exceed the maximum of 15 V difference when connecting the power supplies.
The evaluation board interfaces to the USB port of a PC. The evaluation software is available with the evaluation board that allows the user to easily program the ADG2188. The EVAL-ADG2188EBZ can also be used as a standalone board.
Complete specifications for the ADG2188 are available in the ADG2188 data sheet available from Analog Devices, Inc., and should be consulted in conjunction with this data sheet when using the evaluation board.
Resources
Evaluation Kits1
Tools & Simulations 2
IBIS Model 1
IBIS Model
SPICE Model 1
