ADG1223
Low Capacitance, Low Charge Injection, ±15 V/+12 V iCMOS® Dual SPST Switch
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Features
- <0.5 pC charge injection over full signal range
- Off capacitance: 2 pF
- Off leakage: 2 pA
- Supply range: 33 V
- On resistance: 120 Ω
- Fully specified at ±15 V, +12 V
- No VL supply required
- 3 V logic-compatible inputs
- Rail-to-rail operation
- 10-lead MSOP package
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The ultralow capacitance and exceptionally low charge injection of these switches make them ideal solutions for data acquisition and sample-and-hold applications, where low glitch and fast settling are required. Figure 2 shows that there is minimum charge injection over the full signal range of the device.
The ADG1221/ADG1222/ADG1223 contain two independent single-pole/single-throw (SPST) switches. The ADG1221 and ADG1222 differ only in that the digital control logic is inverted. The ADG1221 switches are turned on with Logic 1 on the appropriate control input, and Logic 0 is required for the ADG1222. The ADG1223 has one switch with digital control logic similar to that of the ADG1221; the logic is inverted on the other switch. The ADG1223 exhibits break-before-make switching action for use in multiplexer applications. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked.
Applications
- Automatic test equipment
- Data acquisition systems
- Battery-powered systems
- Sample-and-hold systems
- Audio signal routing
- Video signal routing
- Communication systems
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ADG1223
Documentation
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Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG1223BRMZ |
10-Lead MSOP
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| ADG1223BRMZ-REEL7 |
10-Lead MSOP
|
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- ADG1223BRMZ
- Pin/Package Drawing
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10-Lead MSOP
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- ADG1223BRMZ-REEL7
- Pin/Package Drawing
-
10-Lead MSOP
- Documentation
-
HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Jan 26, 2016
- 15_0176
Assembly Transfer of Select 8/10L MSOP Products to Amkor Philippines
ADG1223BRMZ
PRODUCTION
ADG1223BRMZ-REEL7
PRODUCTION
May 15, 2012
- 10_0006
Halogen Free Material Change for mini SOIC Products
ADG1223BRMZ
PRODUCTION
ADG1223BRMZ-REEL7
PRODUCTION
Nov 16, 2009
- 06_0157
Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
ADG1223BRMZ
PRODUCTION
ADG1223BRMZ-REEL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1223BRMZ
PRODUCTION
ADG1223BRMZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Jan 26, 2016
- 15_0176
Assembly Transfer of Select 8/10L MSOP Products to Amkor Philippines
ADG1223BRMZ
PRODUCTION
ADG1223BRMZ-REEL7
PRODUCTION
May 15, 2012
- 10_0006
Halogen Free Material Change for mini SOIC Products
ADG1223BRMZ
PRODUCTION
ADG1223BRMZ-REEL7
PRODUCTION
Nov 16, 2009
- 06_0157
Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
ADG1223BRMZ
PRODUCTION
ADG1223BRMZ-REEL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1223BRMZ
PRODUCTION
ADG1223BRMZ-REEL7
PRODUCTION
Software & Part Ecosystem
Evaluation Kits 1
EVAL-10MSOP
Evaluation Board for 10-Lead MSOP Devices in the Switches and Multiplexers Portfolio
Product Detail
The EVAL-10MSOPEBZ evaluation board evaluates 10-lead MSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-10MSOPEBZ to secure a 10-lead MSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.
A 10-lead MSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K10 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
Tools & Simulations 1
SPICE Model 1
SPICE Model
