ADE8167
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ADE8167

Power-Line Communications Master Modem IC

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Features
  • Narrow-band power-line communications IC
    - Integrates physical, data link and networking layers
  • Application layer
    - Supports DL/T 645-1997 or -2007 data protocol (specific to China), as well as a passthrough option
  • Networking layer
    - Automatic baud rate negotiation
    - Dynamic Routing
  • Data link layer
    - CRC Checking
    - Network key for data security
  • Physical layer
    - FSK modulation
    - Up to 2400 bps on a 3-phase network
  • Simple serial interface to host microprocessor
  • Single 3.3V supply, low power (140mW typical)
  • Package and temperature range
    - 40-lead 6 mm × 6 mm LFCSP
    - Fully specified for −40°C to +85°C operation

Additional Details
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In an advanced metering infrastructure (AMI) scenario, the ADE8167 IC provides the essential functions for a master modem; maintaining the network configuration and relaying messages between the utility back office and the slave modems associated with the energy meters.

The ADE8167 is a complete digital baseband processor IC which includes physical layer, data link layer and networking layer functionality. The ADE8167 includes a receive path 12-bit ADC and a transmit path digital demodulator to reduce the external analog front end component count. The ADE8167 UART communicates directly with a host microprocessor. The ADE8167 master modem IC is designed to work with the ADE8157 slave modem IC for a complete power-line communication system.

Applications

  • Power line modems for AMR/AMI systems
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ADE8167

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Obsolete Data Sheet

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UPDATED 10/31/2011
English
ADE8167: Power Line Communications Master Modem IC Obsolete Data Sheet (Rev.SpA) redirect icon

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Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADE8167ACPZ-02 LFCSP:LEADFRM CHIP SCALE
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  • Material Declaration external-link
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  • Reliablity Data external-link
ADE8167ACPZRL-02 LFCSP:LEADFRM CHIP SCALE
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  • Material Declaration external-link
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  • Reliablity Data external-link

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May 23, 2014

- 13_0232

Assembly and Test Transfer of Select 6x6 and 7x7mm LFCSP Products to STATS ChipPAC China

ADE8167ACPZ-02

Obsolete

ADE8167ACPZRL-02

Obsolete

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PCN13_0232_Form

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Material_Report

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Detailed Change Description

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Qualification Results Summary

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Test Correlation Report

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PCN

May 23, 2014

- 13_0232

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Assembly and Test Transfer of Select 6x6 and 7x7mm LFCSP Products to STATS ChipPAC China

ADE8167ACPZ-02

Obsolete

ADE8167ACPZRL-02

Obsolete

pdf

PCN13_0232_Form

external-icon

xls

Material_Report

Download
Detailed Change Description

pdf

Qualification Results Summary

external-icon

pdf

Test Correlation Report

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