ADAU1797
High-Performance Audio Codec with Integrated HiFi 3z and FastDSP Cores
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Features
- FastDSP™ audio processing engine
- Low latency at sample rates up to 768kHz
- Supports up to 128 instructions
- Tensilica® HiFi 3z DSP with TIE accelerators
- Quad MAC/cycle and 1024kB total memory
- 2-way SIMD IEEE floating point multiplier
- Supports both 50MHz and 200MHz modes
- 5μs group delay (analog input to amp output)
- 768kHz sample rate (FastDSP bypass mode)
- Three low power 24-bit ADC record channels
- 104dB SNR, -91dB THD+N, 0.6mW (PGA on)
- Flexible differential or single-ended inputs
- Ten digital microphone (DMIC) input channels
- Two clock outputs (384kHz to 6.144MHz)
- Mono low power 24-bit DAC playback channel
- 113dB SNR, -93dB THD+N, 1.4mW PQ
- High-efficiency, low-noise, Class-D amplifier
- Two high-performance PDM output channels
- Supports 3.072MHz or 6.144MHz clock rates
- Two 32-bit I2S/TDM serial audio data ports
- Sync clock frequencies from 8kHz to 768kHz
- Two full-duplex, 4-channel ASRCs
- Supports low power, single-supply mode (1.8V)
- Integrated LDO or switch-cap regulator
- Digital I/O supports 1.2V or 1.8V logic levels
- Digital Control and Communication interfaces
- I2C/SPI control and I3C combined interfaces
- Master QSPI, UART, and JTAG interfaces
- Supports self-boot from QSPI Flash/EEPROM
- Multi-purpose I/O pins for GPIO / IRQ support
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The device is a low power, high-performance audio codec that provides three analog input channels, ten DMIC input channels, two PDM output channels, and one high-efficiency Class-D amplifier output channel.
The device features a low power HiFi 3z audio DSP core and a low-latency FastDSP core. The audio DSP cores paired with high-fidelity audio data converters are ideal for applications like noise cancellation, transparency, personal sound amplification, and voice processing.
When operating in low-power mode, the DSP cores are optimized for small form factor applications such as true wireless stereo (TWS) headphones. In this mode, the device delivers the right level of processing power while still minimizing power consumption to extend play time.
The device has the flexibility to also support applications requiring additional processing capability such as over-ear headphones, VR and AR headsets, wearables, hearing assist, and PSAP devices. In high-performance mode, the HiFi 3z core is boosted from 50Mhz to 200MHz, and the FastDSP supports double the number of instructions (up from 64 to 128). This increased processing capability can either be used to offload cycles from the host processor or enable a lower-cost host processor without requiring an additional external audio DSP or MCU.
The device supports a -40°C to +85°C temperature range and is available in a space-saving 77-ball WLCSP package (0.4mm pitch, 3.24mm × 4.83mm).
APPLICATIONS
- True wireless stereo (TWS) ANC headphones
- Over-ear stereo ANC headphones
- VR and AR headsets and wearable devices
- Hearing assist and PSAP devices
- Soundbar and smart speaker systems
- Gaming devices and tablets
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ADAU1797
Documentation
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Software & Part Ecosystem
| Parts | Product Life Cycle | Description |
|---|---|---|
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Three ADCs, One DAC, Low Power Codec with Audio DSPs |
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Four ADC, Two DAC, Low Power Codec with Audio DSPs |
Evaluation Kits 1
EVAL-ADAU1797Z
Evaluating the ADAU1797 High-Performance Audio Codec with Integrated HiFi 3z and FastDSP Cores
Product Detail
This user guide explains the setup of the EVAL-ADAU1797Z evaluation board.
This evaluation board provides full access to all analog and digital inputs/outputs on the ADAU1797. The EVAL-ADAU1797Z can be powered by a single 3.8V to 5V supply. Once the main power is supplied, onboard regulators provide the voltages needed for the ADAU1797 and other devices. The printed circuit board (PCB) is an 8-layer design, with a ground plane and power plane on the inner layers. The EVAL-ADAU1797Z contains connectors for external microphones and speakers. The master clock can be provided externally or by the onboard 24.576MHz passive crystal or onboard 24.576MHz oscillator.
