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Features
- 8-Bit ADC with 4.5 µs Conversion Time
- On-Chip Track and Hold
- Operating Supply Range: 2.7 V to 5.5 V
- 8-Bit Parallel Interface 8-Bit Read
- Analog Input Range: 0 V to VREF
- Reference Input Range: 1.2 V to VDD
- Specifications at 2.7 V–3.6 V and 5 V ± 10%
- Power Performance
Normal Operation
10.5 mW, VDD = 3 V
Automatic Power-Down
57.75 µW @ 1 kSPS, VDD = 3 V
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The AD7819 is a high speed, microprocessor-compatible, 8-bit analog-to-digital converter with a maximum throughput of 200 kSPS. The converter operates off a single +2.7 V to +5.5 V supply and contains a 4.5 µs successive approximation A/D converter, track/hold circuitry, on-chip clock oscillator and 8-bit wide parallel interface. The parallel interface is designed to allow easy interfacing to microprocessors and DSPs. Using only address decoding logic the AD7819 is easily mapped into the microprocessor address space.
When used in its power-down mode, the AD7819 automatically powers down at the end of a conversion and powers up at the start of a new conversion. This feature significantly reduces the power consumption of the part at lower throughput rates. The AD7819 can also operate in a high speed mode where the part is not powered down between conversions. In this mode of operation the part is capable of providing 200 kSPS throughput.
The part is available in a small, 16-pin 0.3" wide, plastic dual-in-line package (DIP); in a 16-pin, 0.15" wide, narrow body small outline IC (SOIC) and in a 16-pin, narrow body, thin shrink small outline package (TSSOP).
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AD7819
Documentation
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Documentation
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| AD7819YNZ |
16-Lead PDIP
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| AD7819YRUZ |
16-Lead TSSOP
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| AD7819YRUZ-REEL |
16-Lead TSSOP
|
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| AD7819YRUZ-REEL7 |
16-Lead TSSOP
|
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| AD7819YRZ |
16-Lead SOIC
|
|
|
| AD7819YRZ-REEL7 |
16-Lead SOIC
|
|
- AD7819YNZ
- Pin/Package Drawing
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16-Lead PDIP
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- AD7819YRUZ
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- AD7819YRUZ-REEL
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7819YRUZ-REEL7
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7819YRZ
- Pin/Package Drawing
-
16-Lead SOIC
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7819YRZ-REEL7
- Pin/Package Drawing
-
16-Lead SOIC
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD7819YNZ
PRODUCTION
Feb 11, 2011
- 10_0005
Halogen Free Material Change for TSSOP Products Assembled at Amkor
AD7819YRUZ
PRODUCTION
AD7819YRUZ-REEL
PRODUCTION
AD7819YRUZ-REEL7
PRODUCTION
Oct 5, 2010
- 10_0146
Halogen Free Material Change for 14/16L SOIC_N Products
AD7819YRZ
PRODUCTION
AD7819YRZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD7819YNZ
PRODUCTION
Feb 11, 2011
- 10_0005
Halogen Free Material Change for TSSOP Products Assembled at Amkor
AD7819YRUZ
PRODUCTION
AD7819YRUZ-REEL
PRODUCTION
AD7819YRUZ-REEL7
PRODUCTION
Oct 5, 2010
- 10_0146
Halogen Free Material Change for 14/16L SOIC_N Products
AD7819YRZ
PRODUCTION
AD7819YRZ-REEL7
PRODUCTION
