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Features
- Fast Conversion Time: 5 µs
- On-Chip Track/Hold
- Low Total Unadjusted Error: 1 LSB
- Full Power Signal Bandwidth: 50 kHz
- Single +5 V Supply
- 100 ns Data Access Time
- Low Power (15 mW typ)
- Low Cost
- Standard 18-Lead DlPs or 20-Terminal Surface Mount Packages
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The AD7575 is a high speed 8-bit ADC with a built-in track/hold function. The successive approximation conversion technique is used to achieve a fast conversion time of 5 µs, while the built-in track/hold allows full-scale signals up to 50 kHz (386 µV/ms slew rate) to be digitized. The AD7575 requires only a single +5 V supply and a low cost, 1.23 V bandgap reference in order to convert an input signal range of 0 to 2 VREF.
The AD7575 is designed for easy interfacing to all popular 8-bit microprocessors using standard microprocessor control signals (CS and RD) to control starting of the conversion and reading of the data. The interface logic allows the AD7575 to be easily configured as a memory mapped device, and the part can be interfaced as SLOW-MEMORY or ROM. All data outputs of the AD7575 are latched and three-state buffered to allow direct connection to a microprocessor data bus or I/O port.
The AD7575 is fabricated in an advanced, all ion-implanted high speed Linear Compatible CMOS (LC2MOS) process and is available in a small, 0.3" wide, 18-pin DIP or in 20-terminal surface mount packages.
PRODUCT HIGHLIGHTS
- Fast Conversion Time/Low Power
The fast, 5 µs, conversion time of the AD7575 makes it suitable for digitizing wideband signals at audio and ultrasonic frequencies while retaining the advantage of low CMOS power consumption. - On-Chip Track/Hold
The on-chip track/hold function is completely self-contained and requires no external hold capacitor. Signals with slew rates up to 386 mV/µs (e.g., 2.46 V peak-to-peak 50 kHz sine waves) can be digitized with full accuracy. - Low Total Unadjusted Error
The zero, full-scale and linearity errors of the AD7575 are so low that the total unadjusted error at any point on the transfer function is less than 1 LSB, and offset and gain adjustments are not required. - Single Supply Operation
Operation from a single +5 V supply with a low cost +1.23 V bandgap reference allows the AD7575 to be used in 5 V microprocessor systems without any additional power supplies. - Fast Digital Interface
Fast interface timing allows the AD7575 to interface easily to the fast versions of most popular microprocessors such as the Z80H, 8085A-2, 6502B, 68B09 and the DSP processor, the TMS32010.
Ask a Question
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Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
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AD7575
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962-8776202VX | 18 ld CerDip |
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| AD7575AQ | 18 ld CerDip |
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| AD7575BQ |
18-Lead CerDIP
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| AD7575JNZ |
18-Lead PDIP
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| AD7575JPZ-REEL |
20-Lead Flatpack
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| AD7575KNZ |
18-Lead PDIP
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- 5962-8776202VX
- Pin/Package Drawing
- 18 ld CerDip
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- AD7575AQ
- Pin/Package Drawing
- 18 ld CerDip
- Documentation
-
HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- AD7575BQ
- Pin/Package Drawing
-
18-Lead CerDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- AD7575JNZ
- Pin/Package Drawing
-
18-Lead PDIP
- Documentation
-
HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- AD7575JPZ-REEL
- Pin/Package Drawing
-
20-Lead Flatpack
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7575KNZ
- Pin/Package Drawing
-
18-Lead PDIP
- Documentation
-
HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
5962-8776202VX
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-8776202VX
AD7575AQ
AD7575BQ
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
5962-8776202VX
AD7575AQ
AD7575BQ
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
5962-8776202VX
AD7575AQ
AD7575BQ
Feb 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
5962-8776202VX
Mar 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD7575JNZ
AD7575KNZ
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-8776202VX
AD7575AQ
AD7575BQ
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
Feb 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
Mar 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD7575JNZ
AD7575KNZ
