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The required power supplies are 5 V and -12 V or -15 V. Additional features are better offset and gain error specifications over the original AD7572.
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AD7572A
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| AD7572AANZ03 |
24-Lead PDIP
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| AD7572AANZ10 |
24-Lead PDIP
|
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| AD7572AAQ03 | 24 ld CerDIP(300 Mil) |
|
|
| AD7572AARZ03 |
24-Lead SOIC (Wide)
|
|
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| AD7572AARZ03-REEL |
24-Lead SOIC (Wide)
|
|
|
| AD7572AJNZ03 |
24-Lead PDIP
|
|
|
| AD7572AJNZ10 |
24-Lead PDIP
|
|
|
| AD7572AJRZ03 |
24-Lead SOIC (Wide)
|
|
|
| AD7572AJRZ10 | SOIC 300 MIL |
|
|
| AD7572AJRZ10-REEL7 | SOIC 300 MIL |
|
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| AD7572ALNZ10 |
24-Lead PDIP
|
|
- AD7572AANZ03
- Pin/Package Drawing
-
24-Lead PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7572AANZ10
- Pin/Package Drawing
-
24-Lead PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7572AAQ03
- Pin/Package Drawing
- 24 ld CerDIP(300 Mil)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7572AARZ03
- Pin/Package Drawing
-
24-Lead SOIC (Wide)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7572AARZ03-REEL
- Pin/Package Drawing
-
24-Lead SOIC (Wide)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7572AJNZ03
- Pin/Package Drawing
-
24-Lead PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7572AJNZ10
- Pin/Package Drawing
-
24-Lead PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7572AJRZ03
- Pin/Package Drawing
-
24-Lead SOIC (Wide)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7572AJRZ10
- Pin/Package Drawing
- SOIC 300 MIL
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7572AJRZ10-REEL7
- Pin/Package Drawing
- SOIC 300 MIL
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD7572ALNZ10
- Pin/Package Drawing
-
24-Lead PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Mar 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
AD7572AANZ03
AD7572AANZ10
AD7572AJNZ03
AD7572AJNZ10
AD7572ALNZ10
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD7572AANZ03
AD7572AANZ10
AD7572AJNZ03
AD7572AJNZ10
AD7572ALNZ10
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
AD7572AAQ03
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
AD7572AAQ03
Feb 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
Aug 4, 2010
- 10_0117
Halogen Free Material Change for SOIC_W Products at Carsem
AD7572AARZ03
AD7572AARZ03-REEL
AD7572AJRZ03
Filter by Model
Part Models
Product Lifecycle
PCN
Mar 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
AD7572AANZ03
AD7572AANZ10
AD7572AJNZ03
AD7572AJNZ10
AD7572ALNZ10
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD7572AANZ03
AD7572AANZ10
AD7572AJNZ03
AD7572AJNZ10
AD7572ALNZ10
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
Feb 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
Aug 4, 2010
- 10_0117
Halogen Free Material Change for SOIC_W Products at Carsem
AD7572AARZ03
AD7572AARZ03-REEL
AD7572AJRZ03