AD7569
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AD7569

CMOS, Complete 8-Bit Analog I/0 Port with Single DAC Output

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warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
Part Models 13
1ku List Price Starting From $19.43
Features
  • 2 µs ADC with Track/Hold
  • 1 µs DAC with Output Amplifier
    AD7569, Single DAC Output
    AD7669, Dual DAC Output
  • On-Chip Bandgap Reference
  • Fast Bus Interface
  • Single or Dual 5 V Supplies
Additional Details
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The AD7569 / AD7669 is a complete, 8-bit, analog I/O system on a single monolithic chip. The AD7569 contains a high speed successive approximation ADC with 2 µs conversion time, a track/hold with 200 kHz bandwidth, a DAC and an output buffer amplifier with 1 ms settling time. A temperature-compensated 1.25 V bandgap reference provides a precision reference voltage for the ADC and the DAC. The AD7669 is similar, but contains two DACs with output buffer amplifiers.

A choice of analog input/output ranges is available. Using a supply voltage of +5 V, input and output ranges of zero to 1.25 V and zero to 2.5 volts may be programmed using the RANGE input pin. Using a ±5 V supply, bipolar ranges of ±1.25 V or ±2.5 V may be programmed.

Digital interfacing is via an 8-bit I/O port and standard microprocessor control lines. Bus interface timing is extremely fast, allowing easy connection to all popular 8-bit microprocessors. A separate start convert line controls the track/hold and ADC to give precise control of the sampling period.

The AD7569 / AD7669 is fabricated in Linear-Compatible CMOS (LC2MOS), an advanced, mixed technology process combining precision bipolar circuits with low power CMOS logic. The AD7569 is packaged in a 24-pin, 0.3" wide "skinny" DIP, a 24-terminal SOIC and 28-terminal PLCC and LCCC packages. The AD7669 is available in a 28-pin, 0.6" plastic DIP, 28-terminal SOIC and 28-terminal PLCC package.

Part Models 13
1ku List Price Starting From $19.43

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
5962-89629013X
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5962-8962902LX
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AD7569AQ
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AD7569BNZ
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AD7569BQ
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AD7569BRZ
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AD7569JNZ
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AD7569JPZ
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AD7569JPZ-REEL
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AD7569JRZ
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AD7569KNZ
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AD7569KPZ
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AD7569KPZ-REEL
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Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8962902LX

AD7569AQ

AD7569BQ

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8962902LX

AD7569AQ

AD7569BQ

Mar 7, 2019

- 19_0046

Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Feb 7, 2011

- 10_0003

Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8962902LX

AD7569AQ

AD7569BQ

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8962902LX

AD7569AQ

AD7569BQ

Mar 7, 2019

- 19_0046

arrow down

Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Feb 7, 2011

- 10_0003

arrow down

Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor

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