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Features
- Operates on +5 V and –12 V to –15 V Supplies
- MIL-STD-883 Compliant Version Available
- Complete 8-Bit A/D Converter with Reference, Clock and Comparator
- No Missing Codes Over Temperature
- 30 ms Maximum Conversion Time
- Full 8- or 16-Bit Microprocessor Bus Interface
- Unipolar and Bipolar Inputs
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The AD673 is a complete 8-bit successive approximation analog-to-digital converter consisting of a DAC, voltage reference, clock, comparator, successive approximation register (SAR) and 3-state output buffers-all fabricated on a single chip. No external components are required to perform a full ac-curacy 8-bit conversion in 20 µs.
The AD673 incorporates advanced integrated circuit design and processing technologies. The successive approximation function is implemented with I2L (integrated injection logic). Laser trimming of the high stability SiCr thin-film resistor ladder network insures high accuracy, which is maintained with a temperature compensated sub-surface Zener reference.
Operating on supplies of +5 V and −12 V to −15 V, the AD673 will accept analog inputs of 0 V to +10 V or −5 V to +5 V. The trailing edge of a positive pulse on the CONVERT line initiates the 20 µs conversion cycle. DATA READY indicates completion of the conversion.
The AD673 is available in two versions. The AD673J as specified over the 0°C to +70°C temperature range and the AD673S guarantees ±1/2 LSB relative accuracy and no missing codes from −55°C to +125°C.
Two package configurations are offered. All versions are also offered in a 20-pin hermetically sealed ceramic DIP. The AD673J is also available in a 20-pin plastic DIP.
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AD673
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Documentation
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962-8850502RA | 20 ld Side-Brazed CerDip |
|
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| AD673JNZ | 20 ld PDIP |
|
|
| AD673SD | 20 ld Side-Brazed CerDip |
|
- 5962-8850502RA
- Pin/Package Drawing
- 20 ld Side-Brazed CerDip
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- AD673JNZ
- Pin/Package Drawing
- 20 ld PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD673SD
- Pin/Package Drawing
- 20 ld Side-Brazed CerDip
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
5962-8850502RA
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
5962-8850502RA
AD673SD
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
5962-8850502RA
AD673SD
Mar 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
Mar 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad