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8
1.95 K
SPICE Model
AD587J SPICE Macro Model Rev. A, 11/93
2.15 K
SPICE Model
AD587K SPICE Macro Model Rev. A, 11/93
2.15 K
SPICE Model
AD587L SPICE Macro Model Rev. A, 11/93
2.15 K
SPICE Model
AD587S SPICE Macro Model Rev. A, 11/93
2.15 K
SPICE Model
AD587T SPICE Macro Model Rev. A, 11/93
2.15 K
SPICE Model
AD587U SPICE Macro Model Rev. A, 11/93
2.15 K
SPICE Model
AD587U SPICE Macro Model Rev. A, 11/93
2.15 K
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Features
- Laser trimmed to high accuracy
10.000 V ± 5 mV (U grade) - Trimmed temperature coefficient
5 ppm/°C maximum (U grade)
- Noise-reduction capability
- Low quiescent current: 4 mA maximum
- Output trim capability
- MIL-STD-883-compliant versions available
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The AD587 represents a major advance in state-of-the-art monolithic voltage references. Using a proprietary ion-implanted buried Zener diode and laser wafer trimming of high stability thin-film resistors, the AD587 provides outstanding performance at low cost.
The AD587 offers much higher performance than most other 10 V references. Because the AD587 uses an industry-standard pinout, many systems can be upgraded instantly with the AD587.
The buried Zener approach to reference design provides lower noise and drift than band gap voltage references. The AD587 offers a noise-reduction pin that can be used to further reduce the noise level generated by the buried Zener.
The AD587 is recommended for use as a reference for 8-bit, 10-bit, 12-bit, 14-bit, or 16-bit DACs that require an external precision reference. The device is also ideal for successive approximation or integrating ADCs with up to 14 bits of accuracy. In general, it offers better performance than standard on-chip references.
The AD587J and AD587K are specified for operation from 0°C to 70°C, and the AD587U is specified for operation from −55°C to +125°C. The AD587JQ and AD587UQ models are available in 8-lead CERDIP. Other models are available in an 8-lead SOIC package for surface-mount applications, or in an 8-lead PDIP.
PRODUCT HIGHLIGHTS
- Laser trimming of both initial accuracy and temperature coefficients. This laser trimming results in very low errors over temperature without the use of external components. The AD587U guarantees ±14 mV maximum total error between −55°C and +125°C.
- Optional fine trim connection. This connection is designed for applications requiring higher precision.
- Instant upgrade of any system using an industry-standard pinout 10 V reference.
- Very low output noise. AD587 output noise is typically 4 μV p-p. A noise-reduction pin is provided for additional noise filtering using an external capacitor.
- MIL-STD-883-compliant versions available. Refer to the Analog Devices Military/Aerospace Reference Manual for detailed specifications.
8
1.95 K
SPICE Model
AD587J SPICE Macro Model Rev. A, 11/93
2.15 K
SPICE Model
AD587K SPICE Macro Model Rev. A, 11/93
2.15 K
SPICE Model
AD587L SPICE Macro Model Rev. A, 11/93
2.15 K
SPICE Model
AD587S SPICE Macro Model Rev. A, 11/93
2.15 K
SPICE Model
AD587T SPICE Macro Model Rev. A, 11/93
2.15 K
SPICE Model
AD587U SPICE Macro Model Rev. A, 11/93
2.15 K
SPICE Model
AD587U SPICE Macro Model Rev. A, 11/93
2.15 K
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Search
Other places you can find help
Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page
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AD587
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Data Sheet 2
Frequently Asked Question 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962-8982502PA |
8-Lead CerDIP
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| 5962-8982503PA |
8-Lead CerDIP
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| AD587JNZ |
8-Lead PDIP
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| AD587JQ |
8-Lead CerDIP
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| AD587JRZ |
8-Lead SOIC
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| AD587JRZ-REEL |
8-Lead SOIC
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| AD587JRZ-REEL7 |
8-Lead SOIC
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| AD587KNZ |
8-Lead PDIP
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| AD587KRZ |
8-Lead SOIC
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| AD587KRZ-REEL |
8-Lead SOIC
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| AD587KRZ-REEL7 |
8-Lead SOIC
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| AD587UQ |
8-Lead CerDIP
|
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- 5962-8982502PA
- Pin/Package Drawing
-
8-Lead CerDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- 5962-8982503PA
- Pin/Package Drawing
-
8-Lead CerDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD587JNZ
- Pin/Package Drawing
-
8-Lead PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- AD587JQ
- Pin/Package Drawing
-
8-Lead CerDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- AD587JRZ
- Pin/Package Drawing
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8-Lead SOIC
- Documentation
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HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- AD587JRZ-REEL
- Pin/Package Drawing
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8-Lead SOIC
- Documentation
-
HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD587JRZ-REEL7
- Pin/Package Drawing
-
8-Lead SOIC
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD587KNZ
- Pin/Package Drawing
-
8-Lead PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
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SamacSys
- AD587KRZ
- Pin/Package Drawing
-
8-Lead SOIC
- Documentation
-
HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
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Ultra Librarian
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SamacSys
- AD587KRZ-REEL
- Pin/Package Drawing
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8-Lead SOIC
- Documentation
-
HTML
Material Declaration
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HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD587KRZ-REEL7
- Pin/Package Drawing
-
8-Lead SOIC
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- AD587UQ
- Pin/Package Drawing
-
8-Lead CerDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
5962-8982502PA
5962-8982503PA
Sep 7, 2017
- 17_0079
Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing
5962-8982502PA
5962-8982503PA
AD587JNZ
PRODUCTION
AD587JQ
AD587JRZ-REEL
PRODUCTION
AD587KRZ-REEL
PRODUCTION
AD587KRZ-REEL7
PRODUCTION
AD587UQ
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-8982502PA
5962-8982503PA
AD587JQ
AD587UQ
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
5962-8982502PA
5962-8982503PA
AD587JQ
AD587UQ
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
5962-8982502PA
5962-8982503PA
AD587JNZ
PRODUCTION
AD587JQ
AD587KNZ
PRODUCTION
AD587UQ
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD587JNZ
PRODUCTION
AD587KNZ
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Sep 7, 2017
- 17_0079
Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing
5962-8982502PA
5962-8982503PA
AD587JNZ
PRODUCTION
AD587JQ
AD587JRZ-REEL
PRODUCTION
AD587KRZ-REEL
PRODUCTION
AD587KRZ-REEL7
PRODUCTION
AD587UQ
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-8982502PA
5962-8982503PA
AD587JQ
AD587UQ
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
5962-8982502PA
5962-8982503PA
AD587JNZ
PRODUCTION
AD587JQ
AD587KNZ
PRODUCTION
AD587UQ
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD587JNZ
PRODUCTION
AD587KNZ
PRODUCTION
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SPICE Model 8
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