AD586
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AD586

High Precision 5 V Reference

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 24
1ku List Price Starting From $4.23
Features
  • Laser Trimmed to High Accuracy
    5.00 V ± 2.0 mV (M Grade)
  • Trimmed Temperature Coefficient
    2 ppm/°C Max, 0°C to 70°C (M Grade)
    5 ppm/°C Max, -40°C to +85°C (B and L Grades)
    10 ppm/°C Max, -55°C to +125°C (T Grade)
  • Low Noise, 100 nV/√Hz
  • Noise Reduction Capability
  • Output Trim Capability
  • MIL-STD-883 Compliant Versions Available
  • Industrial Temperature Range SOICs Available
  • Output Capable of Sourcing or Sinking 10 mA
Additional Details
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The AD586 represents a major advance in the state-of-the-art in monolithic voltage references. Using a proprietary ion-implanted buried Zener diode and laser wafer trimming of high stability thin-film resistors, the AD586 provides outstanding performance at low cost.

The AD586 offers much higher performance than most other 5 V references. Because the AD586 uses an industry standard pinout, many systems can be upgraded instantly with the AD586. The buried Zener approach to reference design provides lower noise and drift than bandgap voltage references. The AD586 offers a noise reduction pin which can be used to further reduce the noise level generated by the buried Zener.

The AD586 is recommended for use as a reference for 8-, 10-, 12-, 14- or 16-bit D/A converters which require an external precision reference. The device is also ideal for successive approximation or integrating A/D converters with up to 14 bits of accuracy and, in general, can offer better performance than the standard on-chip references.

The AD586J, K, L and M are specified for operation from 0°C to +70°C, the AD586A and B are specified for -40°C to +85°C operation, and the AD586S and T are specified for -55°C to +125°C operation. The AD586J, K, L and M are available in an 8-pin plastic DIP. The AD586J, K, L, A and B are available in an 8-pin plastic surface mount small outline (SO) package. The AD586J, K, L, S and T are available in an 8-pin cerdip package.

Part Models 24
1ku List Price Starting From $4.23

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
5962-8982401PA
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AD586ARZ
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AD586ARZ-REEL
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AD586ARZ-REEL7
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AD586BRZ
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AD586BRZ-REEL7
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AD586JNZ
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AD586JQ
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AD586JRZ
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AD586JRZ-REEL7
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AD586KNZ
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AD586KQ
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AD586KRZ
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AD586KRZ-REEL
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AD586KRZ-REEL7
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AD586LQ
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AD586LRZ
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AD586LRZ-REEL
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AD586LRZ-REEL7
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AD586MNZ
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AD586SQ
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AD586TQ
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AD586TQ/883B
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Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-8982401PA

PRODUCTION

5962-8982402PA

PRODUCTION

AD586TQ/883B

PRODUCTION

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

5962-8982401PA

PRODUCTION

5962-8982402PA

PRODUCTION

AD586JQ

AD586KQ

AD586LQ

AD586SQ

AD586TQ

AD586TQ/883B

PRODUCTION

Jun 6, 2012

- 12_0066

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

5962-8982401PA

PRODUCTION

5962-8982402PA

PRODUCTION

AD586SQ

AD586TQ/883B

PRODUCTION

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8982401PA

PRODUCTION

5962-8982402PA

PRODUCTION

AD586JQ

AD586KQ

AD586LQ

AD586SQ

AD586TQ

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8982401PA

PRODUCTION

5962-8982402PA

PRODUCTION

AD586JNZ

PRODUCTION

AD586JQ

AD586KNZ

PRODUCTION

AD586KQ

AD586LQ

AD586MNZ

PRODUCTION

AD586SQ

AD586TQ

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-8982401PA

PRODUCTION

5962-8982402PA

PRODUCTION

AD586TQ/883B

PRODUCTION

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

5962-8982401PA

PRODUCTION

5962-8982402PA

PRODUCTION

AD586JQ

AD586KQ

AD586LQ

AD586SQ

AD586TQ

AD586TQ/883B

PRODUCTION

Jun 6, 2012

- 12_0066

arrow down

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

5962-8982401PA

PRODUCTION

5962-8982402PA

PRODUCTION

AD586SQ

AD586TQ/883B

PRODUCTION

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8982401PA

PRODUCTION

5962-8982402PA

PRODUCTION

AD586JQ

AD586KQ

AD586LQ

AD586SQ

AD586TQ

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8982401PA

PRODUCTION

5962-8982402PA

PRODUCTION

AD586JNZ

PRODUCTION

AD586JQ

AD586KNZ

PRODUCTION

AD586KQ

AD586LQ

AD586MNZ

PRODUCTION

AD586SQ

AD586TQ

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

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