AD586
PRODUCTIONHigh Precision 5 V Reference
- Part Models
- 24
- 1ku List Price
- Starting From $4.23
Part Details
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The AD586 represents a major advance in the state-of-the-art in monolithic voltage references. Using a proprietary ion-implanted buried Zener diode and laser wafer trimming of high stability thin-film resistors, the AD586 provides outstanding performance at low cost.
The AD586 offers much higher performance than most other 5 V references. Because the AD586 uses an industry standard pinout, many systems can be upgraded instantly with the AD586. The buried Zener approach to reference design provides lower noise and drift than bandgap voltage references. The AD586 offers a noise reduction pin which can be used to further reduce the noise level generated by the buried Zener.
The AD586 is recommended for use as a reference for 8-, 10-, 12-, 14- or 16-bit D/A converters which require an external precision reference. The device is also ideal for successive approximation or integrating A/D converters with up to 14 bits of accuracy and, in general, can offer better performance than the standard on-chip references.
The AD586J, K, L and M are specified for operation from 0°C to +70°C, the AD586A and B are specified for -40°C to +85°C operation, and the AD586S and T are specified for -55°C to +125°C operation. The AD586J, K, L and M are available in an 8-pin plastic DIP. The AD586J, K, L, A and B are available in an 8-pin plastic surface mount small outline (SO) package. The AD586J, K, L, S and T are available in an 8-pin cerdip package.
Documentation
Data Sheet 2
Frequently Asked Question 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962-8982401PA | 8-Lead CerDIP | ||
| 5962-8982402PA | 8-Lead CerDIP | ||
| AD586ARZ | 8-Lead SOIC | ||
| AD586ARZ-REEL | 8-Lead SOIC | ||
| AD586ARZ-REEL7 | 8-Lead SOIC | ||
| AD586BRZ | 8-Lead SOIC | ||
| AD586BRZ-REEL7 | 8-Lead SOIC | ||
| AD586JNZ | 8-Lead PDIP | ||
| AD586JQ | 8-Lead CerDIP | ||
| AD586JRZ | 8-Lead SOIC | ||
| AD586JRZ-REEL7 | 8-Lead SOIC | ||
| AD586KNZ | 8-Lead PDIP | ||
| AD586KQ | 8-Lead CerDIP | ||
| AD586KRZ | 8-Lead SOIC | ||
| AD586KRZ-REEL | 8-Lead SOIC | ||
| AD586KRZ-REEL7 | 8-Lead SOIC | ||
| AD586LQ | 8-Lead CerDIP | ||
| AD586LRZ | 8-Lead SOIC | ||
| AD586LRZ-REEL | 8-Lead SOIC | ||
| AD586LRZ-REEL7 | 8-Lead SOIC | ||
| AD586MNZ | 8-Lead PDIP | ||
| AD586SQ | 8-Lead CerDIP | ||
| AD586TQ | 8-Lead CerDIP | ||
| AD586TQ/883B | 8-Lead CerDIP |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
| No Match Found | ||
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Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
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| 5962-8982401PA | ||
| 5962-8982402PA | ||
| AD586TQ/883B | ||
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Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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| 5962-8982401PA | ||
| 5962-8982402PA | ||
| AD586JQ | ||
| AD586KQ | ||
| AD586LQ | ||
| AD586SQ | ||
| AD586TQ | PRODUCTION | |
| AD586TQ/883B | ||
|
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
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| 5962-8982401PA | ||
| 5962-8982402PA | ||
| AD586SQ | ||
| AD586TQ/883B | ||
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Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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| 5962-8982401PA | ||
| 5962-8982402PA | ||
| AD586JQ | ||
| AD586KQ | ||
| AD586LQ | ||
| AD586SQ | ||
| AD586TQ | PRODUCTION | |
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Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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| 5962-8982401PA | ||
| 5962-8982402PA | ||
| AD586JNZ | PRODUCTION | |
| AD586JQ | ||
| AD586KNZ | PRODUCTION | |
| AD586KQ | ||
| AD586LQ | ||
| AD586MNZ | PRODUCTION | |
| AD586SQ | ||
| AD586TQ | PRODUCTION | |
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Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
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| AD586JNZ | PRODUCTION | |
| AD586KNZ | PRODUCTION | |
| AD586MNZ | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.