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- Conversion Time: 800 ns
- 1.25 MHz Throughput Rate
- Complete: On-Chip Sample-and-Hold Amplifier and Voltage Reference
- Low Power Dissipation: 570 mW
- No Missing Codes Guaranteed
- Signal-to-Noise Plus Distortion Ratio
fIN = 100 kHz: 70 dB - Pin Configurable Input Voltage Ranges
- See datasheet for additional features
The AD1671 is a monolithic 12-bit, 1.25 MSPS analog-to-digital converter with an on-board, high performance sample-and-hold amplifier (SHA) and voltage reference. The AD1671 guarantees no missing codes over the full operating temperature range. The combination of a merged high speed bipolar/ CMOS process and a novel architecture results in a combination of speed and power consumption far superior to previously available hybrid implementations. Additionally, the greater reliability of monolithic construction offers improved system reliability and lower costs than hybrid designs.
The fast settling input SHA is equally suited for both multiplexed systems that switch negative to positive full-scale voltage levels in successive channels and sampling inputs at frequencies up to and beyond the Nyquist rate. The AD1671 provides both reference output and reference input pins, allowing the on-board reference to serve as a system reference. An external reference can also be chosen to suit the dc accuracy and temperature drift requirements of the application.
The AD1671 uses a subranging flash conversion technique, with digital error correction for possible errors introduced in the first part of the conversion cycle. An on-chip timing generator provides strobe pulses for each of the four internal flash cycles. A single ENCODE pulse is used to control the converter. The digital output data is presented in twos complement or offset binary output format. An out-of-range signal indicates an overflow condition. It can be used with the most significant bit to determine low or high overflow.
The performance of the AD1671 is made possible by using high speed, low noise bipolar circuitry in the linear sections and low power CMOS for the logic sections. Analog Devices' ABCMOS-1 process provides both high speed bipolar and 2-micron CMOS devices on a single chip. Laser trimmed thin-film resistors are used to provide accuracy and temperature stability.
The AD1671 is available in two performance grades and three temperature ranges. The AD1671J and K grades are available over the 0°C to +70°C temperature range. The AD1671A grade is available over the -40°C to +85°C temperature range. The AD1671S grade is available over the -55°C to +125°C temperature range.
PRODUCT HIGHLIGHTS
- The AD1671 offers a complete single chip sampling 12-bit, 1.25 MSPS analog-to-digital conversion function in a 28-pin package.
- The AD1671 at 570 mW consumes a fraction of the power of currently available hybrids.
- An OUT OF RANGE output bit indicates when the input signal is beyond the AD1671’s input range.
- Input signal ranges are 0 V to +5 V unipolar or ±5 V bipolar, selected by pin strapping, with an input resistance of 10 kΩ. The input signal range can also be pin strapped for 0 V to +2.5 V unipolar or ±2.5 V bipolar with an input resistance of 10 MΩ.
- Output data is available in unipolar, bipolar offset or bipolar twos complement binary format.
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AD1671
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
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5962-9312601MXA | 28 ld CerDIP |
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AD1671JP | 28 ld PLCC |
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AD1671JQ | 28 ld CerDIP |
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AD1671KP | 28 ld PLCC |
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AD1671KQ | 28 ld CerDIP |
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- 5962-9312601MXA
- Pin/Package Drawing
- 28 ld CerDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD1671JP
- Pin/Package Drawing
- 28 ld PLCC
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD1671JQ
- Pin/Package Drawing
- 28 ld CerDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD1671KP
- Pin/Package Drawing
- 28 ld PLCC
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- AD1671KQ
- Pin/Package Drawing
- 28 ld CerDIP
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
5962-9312601MXA
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-9312601MXA
AD1671JQ
PRODUCTION
AD1671KQ
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
5962-9312601MXA
AD1671JQ
PRODUCTION
AD1671KQ
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
5962-9312601MXA
AD1671JQ
PRODUCTION
AD1671KQ
Feb 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
5962-9312601MXA
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD1671JP
Obsolete
AD1671KP
Obsolete
Dec 19, 2017
- 17_0069
Obsolescence of Lead (Pb)-Bearing Packages
AD1671JP
Obsolete
AD1671KP
Obsolete
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
5962-9312601MXA
AD1671JQ
PRODUCTION
AD1671KQ
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
Feb 1, 2010
- 10_0020
Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
AD1671JP
Obsolete
AD1671KP
Obsolete
Dec 19, 2017
- 17_0069
Obsolescence of Lead (Pb)-Bearing Packages