MAX77826
PRODUCTIONPower Management IC
Highly Integrated PMIC for Camera and Peripherals in 3mm x 3mm WLP
- Part Models
- 2
- 1ku List Price
- Starting From $8.28
Overview
- Compact Total Solution Size Allows More Peripheral Devices in Smartphones and Tablets
- 3A High-Efficiency BUCK Regulator
- DVS (Dynamic Voltage Scaling) Through HS I²C
- ±1% (typ) Output Voltage DC Accuracy
- Low Power Mode
- 2A BUCK BOOST Regulator
- 15 Linear Regulators with Remote Cap
- 3 NMOS LDOs (VOUT Range: 0.6V to 2.1875V with 12.5mV Step)
- 1 x 150mA
- 1 x 450mA
- 1 x 600mA
- 6 PMOSLV LDOs (VOUT Range: 0.8V to 3.975V with 25mV Step)
- 3 x 150mA
- 3 x 300mA
- 6 PMOSLS LDOs (VOUT Range: 0.8V to 3.975V with 25mV Step)
- 3 x 150mA
- 3 x 300mA
- ±1.5% Typical Output Voltage DC Accuracy
- 70dB PSRR at 1kHz
- Low Power Mode with 2µA (typ) for All LDOs
- 3A High-Efficiency BUCK Regulator
- Simple Management of Power-Up/Down Sequence, Output Voltage Setting, and Fault Detection
- High-Speed (Up to 3.4MHz) I²C Serial Interface
The MAX77826 is a subpower management IC for the latest 3G/4G smartphones and tablets. The MAX77826 contains a high-efficiency BUCK regulator, a BUCK BOOST regulator and 15 LDOs to power up peripherals. The MAX77826 also provides power on/off control logic and an I²C serial interface to program individual regulator output voltages and on/off control for complete flexibility.
The linear regulators support a remote cap feature and provide greater than 70dB PSRR and less than 45µVRMS noise.
The MAX77826 features I²C-compatible, 2-wire serial interface that comprises a bidirectional serial data line (SDA) and a serial clock line (SCL). The MAX77826 supports SCL clock rates up to 3.4MHz.
Applications
- GSM, GPRS, EDGE, CDMA WCDMA, and LTE Smartphones and Tablets
Documentation
Data Sheet 1
Device Drivers 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX77826EWJ+ | Wafer-Level Package 7x7 Bump, Full Array | ||
| MAX77826EWJ+T | Wafer-Level Package 7x7 Bump, Full Array |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Jul 19, 2016 - 1594_AMENDED ASSEMBLY |
||
| MAX77826EWJ+T | PRODUCTION | |
|
Dec 8, 2015 - 1594_PRE-PCN WAFER FAB |
||
| MAX77826EWJ+T | PRODUCTION | |
|
Apr 24, 2014 - 1387 ASSEMBLY,WAFER FAB |
||
| MAX77826EWJ+T | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Software Resources
Device Drivers 1
Evaluation Software 0
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Tools & Simulations
Software Development 1
Evaluation Kits
Evaluation Kit for MAX77826
Resources
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