MAX6604
PRODUCTIONPrecision Temperature Monitor for DDR Memory Modules
Allows high-accuracy (±1°C) temperature readings of memory modules.
- Part Models
- 4
- 1ku List Price
- Starting From $1.26
Part Details
- JEDEC Compliant
- ±1°C Temperature-Monitoring Accuracy
- Overtemperature Interrupt with Programmable Threshold
- +2.7V to +3.6V Operating Voltage Range
- SMBus/I²C-Compatible Interface
- 300µA Typical Operating Current
- 3µA Typical Shutdown Current
- -20°C to +125°C Operating Temperature Range
- 8-Pin TSSOP and 8-Pin TDFN (2mm x 3mm) Packages
The MAX6604 high-precision temperature sensor is designed for thermal monitoring functions in DDR memory modules. The device is readable and programmable through the 2-wire SMBus/I²C-compatible interface. Three address inputs set the bus address for the temperature sensor to provide up to eight devices on one bus.
The internal thermal sensor continuously monitors the temperature and updates the temperature data eight times per second. The master can read the temperature data at any time. Since the thermal sensor is located on the memory module, temperature data recorded accurately represents the temperature of the components on the module. Consequently, the MAX6604 provides a much more accurate measurement of module temperature than techniques involving temperature sensors on the motherboard. In addition, the device responds more quickly to temperature changes on the module than a motherboard sensor.
The MAX6604 also features an interrupt-output indicator for temperature-threshold monitoring. The threshold levels are programmable through the digital interface.
The MAX6604 operates from -20°C to +125°C, and is available in JEDEC-standard 8-pin TSSOP and 8-pin TDFN (2mm x 3mm) packages.
Applications
- Desktop Computers
- Memory Modules
- Networking Equipment
- Notebook Computers
- Workstations
Documentation
Data Sheet 1
Reliability Data 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
MAX6604AAHA+ | Thin Shrink Small-Outline Package | ||
MAX6604AAHA+T | Thin Shrink Small-Outline Package | ||
MAX6604AATA+ | 8-LFCSP-2X3X0.75 | ||
MAX6604AATA+T | 8-LFCSP-2X3X0.75 |
This is the most up-to-date revision of the Data Sheet.
Software Resources
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IBIS Model 1
Evaluation Kits
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